Pfu Limited

Fujitsu Corporation

Tokyo Ohka Kogyo Co., Ltd.

Fujitu Limited

Yasuaki Sugimoto

Tadashi Katsui

Takashi Kitahara

Katsuhiko Nakata

Tadanobu Matsumura

Takeshi Koga

Yoshimi Tanaka

Takayuki Horinishi

Hiroyuki Ohnishi

Masaru Shida

Yumiko Kase

Isao Tateno

A positive photosensitive resin composition with favorable heat resistance and transparency is provided. The photosensitive resin composition contains a resin component (A1) having a structural unit (a1') obtained by substituting at least a portion of hydrogen atoms of phenolic hydroxyl groups within a structural unit represented by a general formula (a1) shown below with a naphthoquinone-1,2-diazide-5-(and/or -4-) sulfonyl group. (In the above general formula, Rrepresents a hydrogen atom or methyl group, Rrepresents a single bond or an alkylene group of 1 to 5 carbon atoms, Rrepresents an alkyl group of 1 to 5 carbon atoms, a represents an integer from 1 to 5, b represents either 0 or an integer from 1 to 4, and a+b is no greater than 5. If two or more Rgroups exist, then these Rgroups may be either the same or mutually different.)

Photosensitive resin composition and color filter

A photosensitive resin composition according to the present invention includes: a copolymer having a repeating unit having a thermal crosslinking group; and a photosensitive agent. As such, the photosensitive resin composition according to the present invention can form a resin with improved heat resistance. Further, a microlens-forming photosensitive resin composition according to the present invention includes: a copolymer having a repeating unit having a thermal crosslinking group; and a photosensitive agent, the copolymer having a mass-average molecular weight of 10,000 to 30,000. As such, the microlens-forming photosensitive resin composition according to the present invention can form a resin with improved heat resistance.

Photosensitive resin composition and microlens formed with use thereof

A positive photosensitive resin composition exhibiting excellent heat resistance is provided, which comprises an alkali-soluble resin component (A) and a photosensitizer (B), the component (A) including a resin component (A1) having a structural unit (a1) represented by general formula (a1) shown below: wherein Rrepresents a hydrogen atom or a methyl group; Rrepresents a single bond or an alkylene group of 1 to 5 carbon atoms; Rrepresents an alkyl group of 1 to 5 carbon atoms; and a represents an integer of 1 to 5, and b represents 0 or an integer of 1 to 4, with the proviso that the sum of a and b is 5 or less, and when two or more Rare present, Rmay be the same or different.

A heat sink mounted on a heat producing element for cooling the heat producing element attached on the printed board of the electronic apparatus, having a heat sink body made of a good heat conductive material and a fan assembly installed inside the heat sink body. The heat sink body is efficiently air-cooled by a cooling air generated by the rotation of the fan assembly. The cooling air forcibly cools a base and a fixing wall of the base adjacent to the heat producing element and plate-like radiating fins or a pin-like radiating fins are protruded on the heat sink body to radiate the heat effectively. The position of the fan assembly is at the center of the heat sink body or is at the offset position from the center of the heat sink body. The heat sink of the present invention can be installed in a portable electronic apparatus such as a portable computer.

Heat sink for cooling a heat producing element and application

Growing community of inventors

Kawasaki, Japan

Yasuaki Sugimoto