Taiyo Holdings Co., Ltd.

Yasuaki Arai

Nobuyuki Yanagida

Yasuyo Kanazawa

Kazuya Sato

Kazuya Kitamura

Kenichi Shirakawa

Tomotaka Noguchi

Eiji Harima

Mariko Shimamiya

A matte-like cured coating film of a curable resin composition is provided on a substrate such as a wiring board, in which scratches are unnoticeable. The cured coating film satisfies Gs (20°)≤5 and Gs (85°)≥35 and has a ratio R represented by the formula R={Gs (85°)/Gs (60°}/{Gs (60°)/Gs (20°)} ranging from 0.35 to 4.0, where Gs (20°), Gs (60°), and Gs (85°) are 20° gloss, 60° gloss, and 85° gloss on a surface of the cured coating film measured according to JIS Z 8741-1997, respectively.

Cured coating film

[Problem] Provided is a two-component type curable resin composition that allows a mixture of an A agent and a B agent to have excellent dispersibility and printability, causes no visible-copper phenomenon, and provides an excellent packing form (receivability) for transportation. [Solution] A two-component type curable resin composition according to the present invention is characterized by including: an A agent containing a carboxyl group-containing resin; and a B agent containing a thermosetting ingredient,

Two-component type curable resin composition, product, dry film, cured product, and printed wiring board

Provided is a thermosetting resin composition which can suppress liquid dripping or bleeding from generating even when used for filling a hole in a printed wiring board having a large opening diameter of a hole part such as a through hole, and in particular, which can suppress cracks from generating even when used for filling a hole in a multilayer printed wiring board having a conductive part and an insulating part on the inner wall of a hole part such as a through hole. The thermosetting resin composition according to the present invention has a viscosity ratio R expressed by formula V/Vin the range of 5.0&#xd7;10to 1.0&#xd7;10, wherein V(dPa&#xb7;s) is the viscosity measured by a cone-flat plate type rotational viscometer (cone-plate type) in accordance with JIS-Z 8803:2011 and V(dPa&#xb7;s) is the minimum value of the melt viscosity measured at 60&#xb0; C. to 100&#xb0; C. in accordance with JIS-K7244-10:2005, and a pencil hardness of HB or more measured by a pencil hardness test according to JIS-K5600-5-4:1999 in a state of heating at 100&#xb0; C. for 160 minutes.

Thermosetting resin composition, cured product thereof, and printed wiring board

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Saitama-ken, Japan

Yasuaki Arai