Hewlett Packard Enterprise Development LP

Yasir Jamal

Vincent W Michna

Nilashis Dey

David Scott Chialastri

Peter A Hansen

A compute device may include one or more processors operable at variable performance levels depending upon power supplied from a compute device power supply. A baseboard management controller of the compute device may periodically calculate an adjustment value for the power supply to adjust the power delivered to the one or more processors. The adjustment value may be calculated as a function of a thermal margin between the temperature of the one or more processors over time and a thermal operating limit of the one or more processors.

Variable enhanced processor performance

A process includes, responsive to a computer platform being in a pre-operating system mode of operation, a first controller receiving serial data from a first external communication connector of the computer platform and the first controller providing a video output based on the serial data; and routing the video output of the first controller to a display device connector. The process includes, determining whether a video driver of the computer platform is communicating with a second controller via a second external communication connector of the computer platform. The video driver is associated with an operating system mode of operation of the computer platform. The process includes, in response to determining that the video driver is communicating with the second controller, routing a video output of the second controller to the display device connector in place of the video output of the first controller.

Providing video content for pre-boot and post-boot environments of computer platforms

Example implementations relate to a fluid cooling assembly for a computing system, and a tool-less method of installing the fluid cooling assembly to the computing system. The fluid cooling assembly includes a plurality of cooling components, and a fluid chamber having a plurality of first fluid connectors. Further, each cooling component includes a plurality of second fluid connectors. Each first fluid connector or each second fluid connector includes a first end to protrude beyond a first surface of a circuit board of the computing system, and a second end to protrude beyond a second surface of the circuit board. Further, the first end of each first fluid connector is connected to the first end of a respective second fluid connector via the circuit board, to establish a parallel fluid flow path between the fluid chamber and each of the plurality of cooling components.

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Houston, TX, United States of America

Yasir Jamal