Nvidia Corporation

Yaping Zhou

Sunil Rao Sudhakaran

Huabo Chen

Don Templeton

Sheetal Jain

Wenjun Shi

Jim Dobbins

Wenjie Mao

John M Wilson

Walker Joseph Turner

Mayan Riat

A device including a stack of dies. Each of the dies can have unit stair-step conductive paths of connection features which include through-die via structures and routing structures. The unit stair-step conductive paths of one of the dies can be interconnected to another one of the unit stair-step conductive paths of another one of the dies to form one of a plurality conductive stair-case structures through two or more of the dies. The unit stair-step conductive paths can be connected to reduce signal cross talk between the conductive stair-case structures whereby at least some of the conductive stair-case structures are connected to transmit a same polarity of electrical signals are spatially separated in a dimension that is perpendicular to a major surface of the dies. A method of manufacturing the device is also disclosed.

Interconnection structures to improve signal integrity within stacked dies

Systems and methods that facilitate resistance and capacitance balancing are presented. In one embodiment, a system comprises: a plurality of ground lines configured to ground components; and a plurality of signal bus lines interleaved with the plurality of ground lines, wherein the interleaving is configured so that plurality of signal bus lines and plurality of ground lines are substantially evenly spaced and the plurality of signal bus lines convey a respective plurality of signals have similar resistance and capacitance constants that are balanced. The plurality of signals can see a substantially equal amount ground surface and have similar amounts of capacitance. The plurality of signal bus lines can have similar cross sections and lengths with similar resistances. The plurality of signal bus lines interleaved with the plurality of ground lines can be included in a two copper layer interposer design with one redistribution layer (RDL).

Resistance and capacitance balancing systems and methods

In one embodiment, a system comprises: a plurality of aggressor bus lines; and a plurality of differential pair bus lines that are located in relatively parallel close proximity to the plurality of aggressor bus lines, wherein at least two of the plurality of differential pair bus lines change location with respect to each other at a point that has a cancelling affect on cross talk from the plurality of aggressor bus lines, wherein the change includes cross over routing. The plurality of differential pair bus lines can convey differential clock signals. The routing of the plurality of differential pair bus lines is substantially parallel to one another before and after the change.

Cross talk reduction differential cross over routing systems and methods

An active component of an integrated voltage regulator (IVR) circuit is deployed within an IC device for regulating an operating voltage thereof. An interposer interconnects the IC device with a power source. A passive inductive component of the IVR circuit is deployed upon a surface of the IC device or the interposer. The inductive component has a magnetic core and a winding (e.g., wire-bond), wound about the magnetic core.

Inductors for integrated voltage regulators

A method for filtering a data signal includes transmitting the data signal from a transmitter to a receiver across a conductor disposed in an interposer, which interconnects the receiver and the transmitter. The data signal is low-passed with a filter, which includes a passive resistive element disposed within the interposer and coupled in series electrically with a passive inductive element. In relation thereto, the interposer is disposed in a position within the interposer, or upon a surface thereof. The filter is coupled to the conductor in a shunt configuration with respect to ground.

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Santa Clara, CA, United States of America

Yaping Zhou