Semiconductor Manufacturing International (Shanghai) Corporation

Semiconductor Manufacturing International (Beijing) Corporation

Zhejiang Hisun Pharmaceutical Co., Ltd.

Yaping Wang

Yi Bu Li

Bin Liu

Hua Bai

Yi Li

Xiaoyu Liu

Peng Sun

Xiaohe Zheng

Po Yuan Chiang

Yingqiu Wu

Guojun Zheng

Lihui Lu

Hongyan Li

Chunchao Fei

Shi Feng

This disclosure provides wafer dicing methods, and relates to the field of semiconductor technologies. Implementations of the dicing method may include: performing laser stealth dicing processing on a wafer from a back surface of the wafer; performing grinding and thinning processing on the back surface of the wafer after performing the laser stealth dicing processing; sticking a dicing tape on the back surface of the wafer after performing the grinding and thinning processing; and performing separation processing on the wafer after sticking the dicing tape. In some implementations, stealth dicing (SD) is performed before grinding, so that a laser is directly imposed on a back surface of a wafer, thereby alleviating a laser attenuation problem and lowering requirements on light transmittance of a dicing tape.

Wafer dicing method

Phenyl propanoic acid compounds having activating effect on peroxisome proliferator-activated receptors (PPAR&#x3b1;,&#x3b4;,&#x3b3;) and a preparation method and uses thereof are provided in the present invention. The compounds can be used for treating or preventing diseases associated with peroxisome proliferator-activated receptors (PPAR&#x3b1;,&#x3b4;,&#x3b3;).

Compounds having activating effect on subtypes of peroxisome proliferator-activated receptors and its preparation method and uses

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Shanghai, China

Yaping Wang