Shanghai Micro Electronics Equipment (Group) Co., Ltd.

Shanghai Micro Electronics Equipment Co., Ltd.

Yaping Ge

Feibiao Chen

Song Guo

Bin Yu

Yuebin Zhu

Hai Xia

Jingchao Qi

Ke Lan

Yonghui Chen

An exposure system (), an exposure apparatus and an exposure method are disclosed. The exposure system () includes: a laser unit (), a light spot switching unit () and a lens unit (); the laser unit () is configured for producing a laser beam; the light spot switching unit () is configured to direct the laser beam to travel along one of different optical paths based on a desired size of a light spot for a workpiece to be exposed so that a laser beam in correspondence with the desired size of the light spot is obtained; and the lens unit () is configured for altering a direction in which the laser beam is incident on the workpiece. The light spot switching unit () enables the laser beam to be switched between the different optical paths so as to form light spots sized in different ranges, which can satisfy different needs of workpieces with various critical dimensions. As a result, an improvement in processing adaptability to different workpieces and a significant reduction in cost can be achieved.

Exposure system, exposure device and exposure method

A flip-chip bonding device and method are disclosed. The bonding device includes: a supply unit () for separating a flip-chip () from a carrier () and providing the flip-chip (), the supply unit () including flipping device (); a transfer unit () for receiving the flip-chip () from the flipping device (); a position adjustment unit () for adjusting the positions of flip-chips () on the transfer unit (); a bonding unit () for bonding the flip-chips () on the transfer unit () onto a substrate (); a transportation unit () for transporting the transfer unit (); and a control unit () for controlling the movement of the preceding units. The transfer unit () is capable of receiving multiple flip-chips () and allows the flip-chips () to be bonded simultaneously. This can result in savings in bonding time and an improvement in throughput. Moreover, during the transportation of the transfer unit (), the positions of the flip-chips () thereon can be adjusted by the position adjustment unit (), thereby ensuring high positional accuracy of the flip-chips () in the subsequent bonding step. As a result, a high-accuracy bonding can be achieved.

Flip chip bonding device and bonding method

A chip bonding device is disclosed, including a first motion stage (), a second motion stage (), a chip pickup element (), a transfer carrier (), a chip adjustment system (), a bonding stage () and a control system (). A chip bonding method is also disclosed, in which a set of chips are temporarily retained on the transfer carrier () and their positions on the transfer carrier () are accurately adjusted by using the chip adjustment system (), followed by bonding the chips on the transfer carrier () simultaneously onto the substrate (). With this batch bonding approach, flip-chips can be bonded with greatly enhanced efficiency. Moreover, picking up and bonding chips in batches can balance times for chip picking up, fine chip position tuning and chip bonding, thereby ensuring high bonding accuracy while increasing the throughput.

Chip bonding apparatus and method

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Shanghai, China

Yaping Ge