The Boeing Company

Honeywell International Inc.

Yaozhong Liu

Shih-Chang Wu

Yi-Chi Shih

Long Bui

Richard Fanucchi

James Patrick Montgomery

Paul G Rosadiuk

Tom Rolfer

Kiet Mai

Sutton Scoltock Jr

Herbert Suyematsu

Multiple beam antenna systems with embedded active transmit and receive RF modules are provided. In one embodiment, an active multiple beam antenna system includes: a spherical lens; a plurality of planar multi-feed assemblies spaced around a region of the spherical lens, wherein each of the planar multi-feed assemblies comprises: a plurality of feeds spaced around and directed into the spherical lens; a plurality of transmit/receive active modules, wherein one respective transmit/receive active module of the plurality of transmit/receive active modules is coupled to each of the plurality of feeds; a first power divider coupled to each of the plurality of transmit/receive active modules; and a second power divider coupled to the first power divider of each of the plurality of planar multi-feed assemblies, the first power divider further configured to couple with a datalink radio.

Multiple beam antenna systems with embedded active transmit and receive RF modules

A reflector assembly implementable in a scanning antenna assembly having a stationary surface includes a support assembly coupled to the stationary surface, a substantially planar first reflector panel coupled to the support assembly so as to enable rotation of the first reflector panel about a central axis of the first reflector panel, and an actuator assembly comprising a translating arm coupled to the first reflector panel, wherein translational motion of the arm is operable to rotate the first reflector panel about the central axis back and forth through a predetermined angular range at a predetermined frequency.

Scanning antenna

A multilayer radio frequency interconnect apparatus includes a plurality of laminated printed wiring boards made of a dielectric material with low loss characteristics for radio frequency electromagnetic radiation. In operation, a RF signal launches from a first signal conductor . A vertical transition from the first signal conductor to a second signal conductor is realized by a 3-wire transmission line. The center conductor of the 3-wire transmission line is a RF via . The two outer conductors are RF ground vias and connect the first RF ground conductor to the second RF ground conductor . These two RF ground vias are isolated from the ground planes which are located between RF signal layers . The advantage of this ground isolation is to maintain the 3-wire transmission line characteristic impedance and to reduce disturbance to electromagnetic fields such that a broadband design may be achieved. The RF ground vias are terminated at signal layers

Multilayer radio frequency interconnect system

A circuit assembly suitable for RF signals has an integration plate and an RF distribution layer disposed adjacent to the integration plate. The RF distribution layer has an RF conductive layer between a first dielectric layer and a second dielectric layer. A DC distribution layer is disposed adjacent to the RF distribution layer. An RF input is coupled to the RF conductive layer. A module assembly includes an integrated circuit coupled to the RF conductive layer and the DC distribution layer. An RF output is coupled to the RF conductive layer.

RF circuit assembly

Growing community of inventors

Torrance, CA, United States of America

Yaozhong Liu