Huawei Technologies Co., Limited

Yaofeng Peng

Rong Chen

Shanjiu Chi

Chengpeng Yang

Zhixin Li

Zhijian Li

Honghui Liu

Shengmei Wu

Changye Jia

A heat dissipation apparatus includes a heat sink housing including an upper housing and a lower housing. The upper and lowers housing are connected in a sealed manner. A primary PCB is fastened to the upper housing, and the primary PCB and the primary heat dissipation plate of the upper housing are disposed opposite to each other. A chip is fastened to a sub PCB. The sub PCB is electrically connected to the primary PCB by using a flexible conductive component. The sub PCB is connected to the primary PCB or the primary heat dissipation plate by using an elastic support component. The elastic support component is configured to press the sub PCB, to enable the chip to be closely attached to the primary heat dissipation plate of the upper housing. A thermally conductive layer is filled between the chip and the upper housing.

Heat dissipation apparatus and in-vehicle module

A noise reduction door related to a noise reduction device in order to resolve a problem that the noise reduction door cannot meet a requirement for different noise reduction effects and different air duct resistance. The noise reduction door includes a T-shaped mechanical part, two fan-shaped mechanical parts, and a door plate. The T-shaped mechanical part and the fan-shaped mechanical part are connected to the door plate using a detachable connection mechanical part. The T-shaped mechanical part is located on a central axis of the door plate, and the two fan-shaped mechanical parts are respectively located on two sides of the T-shaped mechanical part. Therefore, the fan-shaped mechanical part on the door plate may be changed to have different installation positions and installation manners in order to obtain noise reduction doors in different forms. The embodiments of the present disclosure are applied in cabinet noise reduction.

Noise reduction door

A system, including a first pipeline and a second pipeline, where the first pipeline includes a first steam pipe, a first liquid pipe, and an evaporation section connected between the first steam pipe and the first liquid pipe, and the second pipeline includes a second steam pipe, a second liquid pipe, and a heat exchanger connected between the second steam pipe and the second liquid pipe. Two pairs of quick connectors are respectively connected between the first steam pipe and the second steam pipe and between the first liquid pipe and the second liquid pipe. The loop heat pipe includes a valve and a nozzle that are configured for vacuum pumping. Refrigerant is provided inside the loop heat pipe. A capillary structure is provided inside the evaporation section to provide a capillary suction force to enable the refrigerant to circulate in the loop heat pipe.

Heat-pipe heat dissipation system and power device

The present invention is applicable to the technical field of heat-radiation structures and discloses a flow-guiding apparatus and an electronic device including the flow-guiding apparatus. The flow-guiding apparatus includes a support and flow-guiding members for guiding an air flow generated by an axial fan to a directed area, where the flow-guiding members are connected to the support, at least two flow-guiding members are arranged and are located on both sides of a hub of the axial fan or around the hub of the axial fan, and the flow-guiding members tilt toward the hub of the axial fan along an air-blowing direction of the axial fan. The electronic device includes a chassis, where the chassis is provided with an air vent, an axial fan is arranged at the air vent, and an air outlet of the axial fan is arranged with a flow-guiding apparatus mentioned above.

Growing community of inventors

Hangzhou, China

Yaofeng Peng