Mediatek Corporation

Industrial Technology Research Institute

Yao-Tsung Huang

Wei-Che Huang

Ming-Cheng Lee

Cheng-Tien Wan

Yun-San Huang

Ru-Shi Liu

Ming-Jinn Tsai

Jau-Jier Chu

Sheng-Feng Wu

Jiuh-Ming Liang

A semiconductor chip includes a substrate and a transistor. The transistor is formed on the substrate and includes an insulation layer and a fin. The fin includes a base portion and a protrusion connected with the base portion, wherein the protrusion is projected with respect to an upper surface of the base portion and has a recess recessed with respect to the upper surface.

Semiconductor chip

Manufacturing method of semiconductor chip

Semiconductor chip and manufacturing method thereof

Unexpected results were obtained when Tl-1223 and Tl=-2223 superconductive materials were annealed at respectively pre-determined annealing temperatures. The optimum annealing temperatures for Tl-1223 and Tl-2223 superconductive materials are found to be 860.degree. C. and 820.degree. C., respectively. By incorporating the optimum annealing temperature and an optimum annealing envirenment, which is expressed in terms of oxygen partial pressure, into the manufacturing process, the present invention presents a method which can substantially increase the critical temperature of thallium based superconductive materials with greatly reduced annealing time and with improved reproducibility, and is thus superior to any method disclosed in the prior art.

Method to enhance critical temperature of thallium-based superconductors

Preparation of superconducting epitaxial film using the method of liquid phase epitaxial growth comprising the steps of:

Preparation of superconducting epitaxial film using the method of

Growing community of inventors

Hsinchu, Taiwan

Yao-Tsung Huang