Taiwan Semiconductor Manufacturing Comp. Ltd.

Global Unichip Corporation

Yao-Tsu Chen

Sheng-Fan Yang

A power distribution device includes a substrate, a first chip, a first bump, a second bump and a first capacitor. The first chip is configured to receive a first reference voltage signal and a second reference voltage signal. The first bump is located between the substrate and the first chip, and configured to transmit the first reference voltage signal from the substrate to the first chip. The second bump is located between the substrate and the first chip, and configured to transmit the second reference voltage signal from the substrate to the first chip. The first capacitor is located above the substrate and below the first chip. A first terminal of the first capacitor is coupled to the first bump, and a second terminal of the first capacitor is coupled to the second bump. A power distribution system is also disclosed herein.

Growing community of inventors

Hsinchu, Taiwan

Yao-Tsu Chen