Applied Materials, Inc.

Yao-Hung Yang

Tom K Cho

Siamak Salimian

Aniruddha Pal

Chih-Yang Chang

Chien-Min Liao

Sanjeev Baluja

Thomas E Nowak

Shantanu Rajiv Gadgil

Chun-Chung Chen

Shannon Wang

Tuan Anh Nguyen

Jeonghoon Oh

Sudhir R Gondhalekar

Juan Carlos Rocha

Andrzej Kaszuba

Dustin Wenpin Ho

Andrew S Yu

Tao Hou

Vincent Kirchhoff

Kaushik Rao

Frank F Hooshdaran

Hsiu Yang

Jeevan Shanbhag

Shagun P Maheshwari

Munirah Mahyudin

Daniel Chou

Sagir Kadiwala

Saurabh M Chaudhari

Juan Carlos Rocha-Alvarez

Dien-Yeh Wu

Scott A Hendrickson

Abhijit Ashok Kangude

Yikai Chen

Sam Hyungsam Kim

Jianqi Wang

Liliya Krivulina

Fred Eric Ruhland

Earl Hunter

Boon Sen Chan

Eric Ruhland

David Ganon

Tanmay Pramod Gurjar

Hsui Yang

Mariana Luigi

King F Lee

Gaurav Shrivastava

Scott Lin

Philip Wayne Nagle

Tianshu Li

Yu-Chi Yeh

Pavankumar Ramanand Harapanhalli

Andrzej Matlosz

Michael Martinelli

A method for forming a part for a process chamber incorporates a substrate core in the part. The method may include performing a silicon carbide (SIC) deposition process on a substrate to form a SiC coating of approximately 1 mm to approximately 2 mm on all sides of the substrate to form a composite SiC structure where the substrate is composed of a stack of a plurality of substrates each with a thickness of approximately 1 mm to approximately 2 mm and separating the stack of the plurality of substrates of the composite SiC structure to form multiple composite structures where each multiple composite structure has an SiC coating on a top surface and on all side surfaces and a bottom surface of exposed substrate material.

Composite structures for semiconductor process chambers

Methods and apparatus for scanning a code on or in a transparent part, the method comprising: illuminating the code to generate a projected image of the code on a projection surface spaced from the transparent part; and machine scanning the projected image.

Method and system for scanning a code on a transparent part

Embodiments of substrate supports are provided herein. In some embodiments, a substrate support includes: a first plate having a plurality of openings extending into the first plate from an upper surface of the first plate to a bottom surface of each respective opening of the plurality of openings; a plurality of tabs comprising three or more tabs disposed in each respective opening and extending towards the upper surface of the first plate; and a plurality of support elements disposed in each of the plurality of openings, wherein the plurality of tabs are disposed around each of the plurality of support elements and configured to retain the plurality of support elements in the plurality of openings.

Tab arrangement for retaining support elements of substrate support

A method of determining an operational status of a semiconductor manufacturing assembly uses internal vibrations of an in-situ assembly to detect defects. The method may include initiating a first test vibration in an internal structure of the semiconductor manufacturing assembly while the semiconductor manufacturing assembly is in-situ in a semiconductor processing chamber, receiving a first vibration signal caused by the first test vibration, transforming the first vibration signal into a first frequency domain representation of the first vibration signal, determining the operational status of the semiconductor manufacturing assembly based on the first frequency domain representation, and performing a corrective action for the semiconductor manufacturing assembly in response to the operational status.

Detecting defects of semiconductor manufacturing assemblies

Methods for texturing a surface of a component which include partially submerging the component within a liquid such that a first portion of the component is not submerged in the liquid and a second portion of the component is submerged in the liquid; and contacting at least the first portion of the component with a laser beam at a power and for a period of time sufficient to texture the first portion of the component to a first surface roughness, wherein the second portion of the component is either not textured by the laser beam, or is textured to a lesser degree than the first portion of the component and has a second surface roughness which is less than the first surface roughness.

Method and apparatus for laser texturing a component

A sealing member includes a monolithic body including a first portion adjoining a second portion. The first portion forms part of a circle. The second portion includes first and second lobes. Each lobe adjoins the first portion with a concave surface. In one example, each lobe includes a rounded tip, and a convex surface extends from one rounded tip to the other rounded tip.

Sealing member with lip seal

A lamp and epitaxial processing apparatus are described herein. In one example, the lamp includes a bulb, a filament, and a plurality of filament supports disposed in spaced-apart relation to the filament, each of the filament supports having a hook support and a hook. The hook includes a connector configured to fasten the hook to the hook support, a first vertical portion extending from the connector toward the filament, and a rounded portion extending from an end of the first vertical portion distal from the connector and configured to wrap around the filament. A second vertical portion extends from an end of the rounded portion distal from the first vertical portion and the second vertical portion has a length between 60% and 100% of the length of the first vertical portion.

High power tungsten halogen lamp lifetime improvement through J-hook design

Embodiments of showerheads for use in a process chamber and methods of reducing drooping of a showerhead faceplate are provided herein. In some embodiments, a showerhead for use in a process chamber includes: a faceplate having a plurality of gas distribution holes disposed therethrough; and one or more cables that engage with the faceplate and configured to prestress the faceplate.

Faceplate tensioning method and apparatus to prevent droop

Seal for an assembly in a vapor deposition chamber

The present disclosure is directed to a system and method to identify and track parts of a semiconductor processing chamber, as well as the status of the parts, and store status information in a centralized location as status changes over time.

Method and system for improving the operation of semiconductor processing

Certain embodiments provide a method and non-transitory computer readable medium having instructions that, when executed by a processor of a processing system, cause the processing system to perform a method for improving operation of a semiconductor processing system. The method of part life estimation generally includes obtaining a chamber part having a first surface portion and second surface portion. A data matrix in the first portion of the chamber part is read. The data matrix has raised features. The first portion of the chamber part is cleaned. Wear on the raised features is evaluated. The part is discarded in response to the wear on the raised feature.

Part-life estimation utilizing feature metrology

A sealing member is provided, including a plurality of nodes and a plurality of antinodes. Each sealing member can be rotated to expose nondamaged lobes for sealing, and prevents the sealing member from falling out of the lobed groove. A chamber is provided, including a groove that the sealing member is placed in. A method of rotating and placing the sealing member is provided, including a rotation to expose nondamaged portions of the sealing member.

Multinode multi-use O-ring and method for forming a seal

A method of reclaiming a used seal includes boiling the used seal in a liquid, and after boiling the used seal in the liquid, baking the used seal. The boiling the used seal may include boiling for a predetermined boiling time in the liquid, and the baking the used seal may include baking the used seal for a predetermined bake time at a predetermined temperature.

Method of reclaiming a seal

The present disclosure relates to systems and methods for semiconductor tool part tracking and kit verification. Data relating to part identification and performance are encoded to a unique code that is encoded into machine-readable form, such as a data matrix. A multi-dimensional array (MDA) of the data matrices of a group of parts is a 'golden MDA'. When assembled into a kit, the parts are scanned and compared to the golden MDA. If there's a match, a kit unique code is used to generate a kit data matrix. The part data matrix codes are provided to a database to determine if a part combination will cause a coupling effect, based on part usage history.

Methods and systems for multi-part authentication and tracking

Growing community of inventors

Santa Clara, CA, United States of America

Yao-Hung Yang