Taiwan Semiconductor Manufacturing Comp. Ltd.

Yao-Hsien Tsai

Cheng-Hung Yeh

Po-Hsiang Huang

Yi-Kan Cheng

Chin-Chou Liu

Fong-Yuan Chang

Hsien-Hsin Sean Lee

Chin-Her Chien

Kai-Ming Liu

Chin-Yuan Huang

Kai-Yun Lin

Chi-Ting Huang

Tai-Yu Wang

Ming-Ke Tsai

A package structure and a method for forming the same are provided. The package structure includes a die, a first molding surrounding the die, a first redistribution layer (RDL), an interposer disposed over the first RDL, a second molding surrounding the interposer, a first via, and a second RDL. The first RDL includes a first dielectric layer disposed over the die and the first molding, and a first interconnect structure surrounded by the first dielectric layer and electrically connected to the die. The interposer is electrically connected to the die through the first interconnect structure. The first via extends through and within the second molding and is adjacent to the interposer. The second RDL includes a second dielectric layer disposed over the interposer and the second molding, and a second interconnect structure surrounded by the second dielectric layer and electrically connected to the via and the interposer.

Package structure and method for forming the same

A method for verifying the design of an IC having a plurality of tiers includes conducting a layout versus schematic ('LVS') check to separate a plurality of devices of a plurality of design layouts, wherein each design layout corresponds to a respectively different tier having the respective devices. A plurality of adjacent tier connections are generated between one of the devices in respectively different tiers from each other, using a computing device. A first RC extraction for each of the tiers is performed to compute couplings between each of the plurality of devices of the corresponding design layout. A second RC extraction for each of the adjacent tier connections is performed.

Method and system for verifying the design of an integrated circuit having multiple tiers

Growing community of inventors

Hsinchu County, Taiwan

Yao-Hsien Tsai