Taiwan Semiconductor Manufacturing Comp. Ltd.

Yao-Cheng Wu

Tsung-Ding Wang

Hao-Cheng Hou

Jung-Wei Cheng

Jeng-An Wang

Tseng Hsing Lin

A first polymer layer is formed across a package region and a test region. A first metal pattern is formed in the package region and a first test pattern is simultaneously formed in the test region. The first metal pattern has an upper portion located on the first polymer layer and a lower portion penetrating through the first polymer layer, and the first test pattern is located on the first polymer layer and has a first opening exposing the first polymer layer. A second polymer layer is formed on the first metal pattern in the package region and a second test pattern is simultaneously formed on the first test pattern in the test region. The second polymer layer has a second opening exposing the upper portion of the first metal pattern, and the second test pattern has a third opening greater than the first opening of the first test pattern.

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Changhua County, Taiwan

Yao-Cheng Wu