Au Optronics Corporation

Yao-An Mo

Chieh-Jen Cheng

Hsin-An Chang

Chia-Hun Cheng

Chun-Liang Lin

Chieh-Wei Chen

Chung-Chun Lee

Chiung-Han Wang

Ta-Jen Huang

Min-Ling Hung

Min-Chieh Hu

Hung-Chuo Lee

Chun-Shiang Yan

Chin-Shan Chen

Chia-Chang Yang

Kang-Wei Cheng

Hsien-Hsin Yeh

An organic luminance device includes a base substrate, a organic luminance multi-layered structure and a cover substrate. Furthermore, a protective film is used to wrap the light emitting surface and at least one lateral surface of the base substrate to prevent the substrate from crack. The protective film may be doped with one or more dopants having a refractive index different from original material of the protective film.

Organic luminance device, method for manufacturing same and lighting apparatus including same

A dual display module for use in a display apparatus is provided. The dual display module includes a first display module, a first light source, a second display module, a second light source and a printed circuit board electrically connected with the first display module and the second display module. The second light source, which provides light to the second display module, is directly disposed onto the printed circuit board.

Dual display module

An organic light emitting device includes an organic light emitting panel and at least one light extraction enhanced film. The organic light emitting panel has at least one light emitting surface. The light extraction enhanced film is disposed on the light emitting surface of the organic light emitting panel, and the light extraction enhanced film has a recess array. The recess array includes a plurality of recess holes. The recess holes are recessed toward the organic light emitting panel.

Organic light emitting device

A flexible printed circuit board includes a substrate, signal lines, a first reinforcing layer, and a second reinforcing layer. The first surface of the substrate includes a layout zone and a reinforcing zone disposed nearby the layout zone. The signal lines are disposed on the layout zone. The first reinforcing layer is disposed on the reinforcing zone. The second reinforcing layer is disposed on the second surface of the substrate.

Flexible printed circuit board

A flat panel display module is introduced herein, which principally includes an upper bezel, a liquid crystal panel, a frame, an optical film set and a printed circuit board assembly (PCBA), wherein various types electrical components mounted on the PCBA are capable of being completely or mostly accommodated within a caved structure constructed within the inside of the flat panel display module so as to reduce a thickness of the whole flat panel display module. Simultaneously, a better structural strength for the whole flat panel display module can be achieved therefore by closely stacking up the above-mentioned elements of the whole flat panel display module.

Flat panel display module

An organic light-emitting diode (OLED) module includes a substrate, a bus line, an organic light-emitting device layer, a plurality of conductive elements, and at least one conductive wire. The bus line is configured on the substrate. The organic light-emitting device layer is configured on the substrate and electrically connected to the bus line. The conductive elements are configured on the substrate and electrically connected to the bus line. The conductive wire is configured next to the conductive elements and electrically connected to the conductive elements.

Organic light-emitting diode module

An organic electroluminescence device including a substrate, an organic emitting device layer, a circuit board, a sealant and an electrical bonding layer is provided. The organic emitting device layer is on the substrate and has a first electrode layer, an emitting layer and a second electrode layer. The first electrode layer is disposed on the substrate, the emitting layer is disposed on the first electrode layer and the second electrode layer is disposed on the emitting layer. The circuit board is disposed over the substrate and covers the organic emitting device layer. The sealant is disposed between the substrate and the circuit board to seal the circuit board on the substrate. The electrical bonding layer is disposed between the substrate and the circuit board to electrically connect the circuit board and the first electrode layer of the organic emitting device layer.

Organic electroluminescence device and electronic device having the same

The present disclosure is a backlight module including a light guide plate, a supporter, and a light source module. The light guide plate has a light incident side. The supporter has a bottom plate, a sidewall, and a top plate corresponding to the bottom plate. The bottom plate extends from a first end of the sidewall toward the light guide plate, and the top plate extends along a second end of the sidewall toward the light guide plate. The length of the sidewall is longer than the length of the top plate, such that the top plate corresponding to the sidewall forms at least one breach to expose the second end of the sidewall. The bottom plate, the top plate, and the sidewall together form an accommodating space, and the light incident side of the light guide plate is disposed between the top plate and the bottom plate. The light source module is disposed in the accommodating space and partially exposed through the at least one breach. The light source module has at least one light emitting unit and a printed circuit board. The light emitting unit is disposed on the printed circuit board, such that an emitting surface of the light emitting unit can face the light incident side of the light guide plate.

Backlight module and display device using the same

A display device and a backlight module thereof are provided. The display device further includes a display panel having a display area. The backlight module is disposed under the display panel and includes a light source holder, a light source, and a light guide plate. The light source holder has a sidewall, a top plate, and a bottom plate, wherein the bottom plate partially overlaps the display area of the display device. The light guide plate is disposed corresponding to the display area of the display device and has one end located in an opening between the top plate and the bottom plate. A thermal isolating layer is interposed between the light guide plate and a portion of the bottom plate which corresponds to the display area. The perpendicular distance between the light guide plate and the portion of the bottom plate overlapping the thermal isolating layer is greater than a perpendicular distance between the light guide plate and the other portion of the bottom plate.

Display device and backlight module with thermal isolating layer

An electro-luminescence (EL) panel is provided. The EL panel comprises a substrate, a cover, an EL device, and a buffer structure. The cover is disposed above the substrate. The EL device is disposed on the substrate and between the substrate and the cover. The buffer structure is disposed on the cover and between the EL device and the cover.

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Hsin-Chu, Taiwan

Yao-An Mo