Innogrit Technologies Co., Ltd.

Sandisk Information Technology (shanghai) Co., Ltd.

Yanwen Bai

Shiann-Ming Liou

Gang Zhao

Chin-Tien Chiu

Wei Zhang

Chih-Chin Liao

Lin Chen

Yazhou Zhang

Yangming Liu

Ye Bai

Shineng Ma

Abhilash Mathew

The present disclosure provides a packaging-level chip and a chip module packaged with a magnetic cover, and an electronic product. The packaging-level chip packaged with a magnetic cover comprises a die, a packaging material, a substrate and a magnetic cover. The packaging material is packaged on the outside of the die which is arranged on the substrate, and the magnetic cover is packaged on the top of the packaging material and is magnetic.

Packaging-level chip and chip module packaged with magnetic cover, and electronic product

The present disclosure discloses a multilayer circuit board comprising a plurality of metal layers, a blind via and/or a buried via, the multilayer circuit board is capable of transmitting signal between the different metal layers. The blind via has a pad on a non-opening side of the blind via. An upper or lower layer metal layer on the non-opening side of the blind via adjacent to the blind via has a first hole which is located in a position corresponding to the pad on the non-opening side of the blind via in a depth direction of the blind via; and/or an upper and/or lower layer adjacent to the buried via has a second hole which is located in a position corresponding to the pad of an upper and/or lower orifice of the buried via in a depth direction of the buried via.

Multilayer circuit board

Systems and apparatus are provided for a removable non-volatile storage device. An exemplary embodiment may provide an apparatus that may comprise a package that may have a first and a second sets of contact pins. The package may have a dimension and the first set of contact pins may be arranged according to a specification of a first type of storage device. The second set of contact pins may be configured to conduct a subset of electrical signals for a second type of storage device. The package may further comprise a controller inside the package and configured to function as the first type of storage device when the first set of contact pins are electrically connected to a host and as the second type of storage device when both the first set and the second set of contact pins are electrically connected to the host.

Removable non-volatile storage card

A semiconductor device including control switches enabling a semiconductor die in a stack of semiconductor die to send or receive a signal, while electrically isolating the remaining die in the die stack. Parasitic pin cap is reduced or avoided by electrically isolating the non-enabled semiconductor die in the die stack.

Semiconductor device including control switches to reduce pin capacitance

Growing community of inventors

Shanghai, China

Yanwen Bai