Google Inc.

Elta Systems Ltd.

Modu Ltd.

Terahertz Group Ltd.

Yaniv Maydar

Eyal Bychkov

Itay Cohen

Noam Bernstein

Xiaolin Yin

Yaohua Hou

Michael Ip Siu Kong

Michael Kedem

Eran Gabbai

Regina Aharonov-Nadborny

Eitan Neeman

Raviv Angel

Yohai Joseph

Tzvi Gadasi

Naor Baruch

Gil Peshes

An integrated circuit assembly and a method for fabricating the same are disclosed. The integrated circuit assembly includes: a base structure including an interposer board and a plurality of interfacing dies electrically coupled to said interposer board; a cap structure including an intermediating board and a panel of active elements having a plurality of active elements electrically coupled to the intermediating board. The cap structure is attached to the base structure such that the active elements are electrically coupled to the interfacing dies. Also disclosed are a tile including a backend circuit board configured to attach to the plurality of integrated circuits and provide electrical connectivity thereto the plurality of integrated circuits, and a method of fabricating the same, as well as an array of the plurality of such tile in cascade connection.

Wafer level integration of transducer elements, techniques and implementations

Safety station

A high throughput method for label-free, noncontact, noninvasive, and nondestructive detection of at least one virus infected or virus free individual from at least one tested individual is provided. The method includes collecting a sample from exhaled breath of a subject for analysis of the sample. The collecting includes the subject exhaling into at least one sampler and collecting aerosols and/or any airborne compound from the exhaled breath by passing the exhaled breath through a metamaterial membrane within the sampler. The metamaterial membrane is arranged transverse to a flow of exhaled breath through the sampler. The method further includes analyzing the sample for detection of at least one virus infected individual from at least one tested individual.

Systems and methods for non-invasive determination of COVID-19 coronavirus infection

An integrated circuit device and a method of fabricating the same are presented. The integrated circuit device () includes two or more active components (), possibly fabricated by different semiconductor technologies, and an interposer structure () adapted for carrying the two or more active components such that at least one of the active components is carried on a top surface of the interposer structure. The integrated circuit device also includes at least one metal cap (), furnished on the top surface of the interposer structure and encapsulating at least one of the active components. Some variants of the integrated circuit device of the invention are suited for operation under extreme conditions.

Integrated electronic device including an interposer structure and a method for fabricating the same

A connector assembly for a modular device that connects to a host device, including a receptacle forming part of a host electronic device, and a connector plug mounted on one side of a modular electronic device, for use with two operational modes of the modular device, including a first connector for engagement with the receptacle in a first operational mode in which the modular device is connected with the host device, and a second connector for engagement with a cable external to the modular device in a second operational mode in which the modular device is not connected with the host device, the second connector being covered by the host device but not engaged therewith when the first connector is engaged with the receptacle, thus enabling the modular device to be used with a host or alternatively removed from the host and connected to a cable for external use.

Card connector assembly with plug having first and second connector

An apparatus, including a chassis having an opening into which an electrical component is insertable, means for coupling to the electrical component, the means for coupling slidably movable, relative to the chassis, in a first direction generally away from the opening, and in a second direction generally toward the opening to a first position in response to force in the first direction exerted upon the means for coupling, and to a second position in response to force in the first direction exerted upon the means for coupling when the means for coupling is in the first position, wherein the first position is different, with respect to the chassis, than the second position.

Push-to-insert, push-to-eject and pull-to-extract card connector

An assembly for a receptacle for an electrical connector plug, including a chassis for inserting an electrical connector plug therein, two slideable grooved latches mounted on two opposite side surfaces of the chassis, that slide along the two opposite sides under applied force, two springs fastened to respective ones of the two slideable latches, mounted on the two opposite side surfaces of the chassis, a bar mounted between the two slideable latches, and a receptacle for the connector plug, mounted on the bar and including a plurality of contact pins for electrical contact with the connector plug, wherein (i) when the connector plug is pushed into the receptacle, the two slideable latches are pushed away from respective ones of the two springs, causing the two springs to stretch and to exert tensions thereon, and (ii) when the connector plug is pushed a second time, the two slideable latches are released, causing the connector plug to be partially ejected from the receptacle.

Electronic device connector

Growing community of inventors

Tel Aviv, Israel

Yaniv Maydar