Dow Silicones Corporation

Dow Corning Corporation

Ddp Specialty Electronic Materials US 9, LLC

Yanhu Wei

Steven Swier

Marc-Andre Courtemanche

Zhenbin Niu

Eun Sil Jang

Nanguo Liu

Peng-Fei Fu

Randall Gene Schmidt

John Bernard Horstman

Fumito Nishida

Shengqing Xu

Lizhi Liu

A composition containing: (a) a polysiloxane resin, wherein the polysiloxane resin contains the following siloxane units: [R3SiO], [(OZ)SiO] and at least one of [(OZ)RSiO] and [(OZ)RRSiO]; where: each R is independently in each occurrence selected from hydrocarbyls, Ris an epoxy functional hydrocarbyl group, subscript q is in each occurrence a number selected from a range of 0-3, subscript t is in each occurrence a number selected from a range of 0-2, and subscript d is in each occurrence a number selected from a range of 0-1 provided that the average concentration of OZ groups is at least 15 mole-percent relative to moles of silicon atoms in the polysiloxane resin; (b) a photo acid generator; (c) a moisture cure catalyst; and (d) optionally, an epoxy functional diluent.

Dual cure composition

A composition contains a mixture of silyl hydride, an alpha-beta unsaturated ester, a Lewis acid catalyst and an amine having the following formula: RRRN; where the nitrogen is not a member of an N═C—N linkage and where each of R, R, and Ris independently selected from a group consisting of hydrogen, alkyl, substituted alkyl, and conjugated moieties; and wherein at least one of R, Rand Ris a conjugated moiety connected to the nitrogen by a conjugated carbon.

Thermally initiated acid catalyzed reaction between silyl hydride and alpha-beta unsaturated esters

An epoxy-curable silicone release coating composition and methods for its preparation and use are provided. The composition contains an inhibited Lewis acid catalyst. Releasing the Lewis acid catalyst from the inhibitor allows the Lewis acid to catalyze cure of the epoxy-groups. The composition can be coated on various substrates and cured to form a release liner.

Epoxy-curable silicone release coating composition and methods for its preparation and use

A composition contains a mixture of silyl hydride, a siloxane, a Lewis acid catalyst and an amine having the following formula: RRRN; where the nitrogen is not a member of an N═C—N linkage and where each of R, R, and Ris independently selected from a group consisting of hydrogen, alkyl, substituted alkyl, and conjugated moieties; and wherein at least one of R, Rand Ris a conjugated moiety connected to the nitrogen by a conjugated carbon.

Thermally initiated acid catalyzed reaction between silyl hydride and siloxane

A composition contains a mixture of silyl hydride, a silanol and/or a silyl ether, and a Bridged Frustrated Lewis Pair.

Bridged frustrated Lewis pairs as thermal trigger for reactions between Si—H and Si—OR

A composition contains a mixture of silyl hydride, a silanols and/or silyl ether, a Lewis acid catalyst and an amine having the following formula: RRRN; where the nitrogen is not a member of an N═C—N linkage and each of R, R, and Ris independently selected from a group consisting of hydrogen, alkyl, substituted alkyl, and conjugated moieties; and wherein at least one of R, Rand Ris a conjugated moiety connected to the nitrogen by a conjugated carbon.

Thermally initiated acid catalyzed reaction between silyl hydride and silyl ether and/or silanol

A composition contains an alpha-beta unsaturated ester, a silyl hydride, and a Bridged Frustrated Lewis Pair.

Bridged frustrated Lewis pairs as thermal trigger for reactions between Si—H and alpha-beta unsaturated esters

A composition contains a mixture of silyl hydride, a siloxane and a Bridged Frustrated Lewis Pair and can be thermally triggered to cure.

Bridged frustrated lewis pairs as thermal trigger for reactions between Si—H and Si—O—Si

A composition contains a mixture of silyl hydride, epoxide and a Bridged Frustrated Lewis Pair.

Bridged frustrated Lewis pairs as thermal trigger for reactions between Si-H and epoxide

A silicone resin is disclosed. The silicone resin is free from carbon atoms. A method of preparing the resin is additionally disclosed. This method comprises reacting a silane compound and a precursor compound, thereby preparing the silicone resin. A composition including the silicon resin and a vehicle is further disclosed. A method of preparing a film with the composition is also disclosed. This method comprises applying the composition including the silicone resin and the vehicle to a substrate to form a layer. This method also includes heating the layer to give the film.

Silicone resin, related methods, and film formed therewith

Described are hydrosilylation-curable polyorganosiloxane compositions containing sulfur, including hydrosilylation-curable polyorganosiloxane prepolymers and hydrosilylation-cured polyorganosiloxane polymer products made therefrom, as well as methods of preparing and using the same, devices comprising or prepared from the same, and sulfur-functional organosiloxanes useful therein.

Sulfur-containing polyorganosiloxane compositions and related aspects

The present disclosure provides methods of making organosiloxane polymer compositions from hydrosilylation curable compositions comprising at least the components (a) and (b) and at least one of components (c) and (d): (a) an organosiloxane resin material comprising aliphatic unsaturation; and (b) an organosiloxane crosslinker comprising multiple silicon atom-bonded hydrogen atoms (e.g., an 'SiH siloxane'); in combination with at least one of (c) at least one organosiloxane comprising at least two silicon atom-bonded hydrogen atoms; and (d) at least one organosiloxane comprising at least two silicon atom-bonded hydrocarbyl groups comprising aliphatic unsaturation (e.g., a 'di-vinyl functional siloxane'). Such hydrosilylation curable compositions have, in some instances, significantly faster cure speed, relative to their condensation curable counterparts. A faster cure speed can be important for encapsulating electronic devices, such as light-emitting diode (LED) chip devices, including devices having tall structures.

Organosiloxane compositions and uses thereof

The various embodiments of the present invention relate to condensation curable silicone compositions comprising: a condensation curable polyorganosiloxane; and treated particles comprising a particulate solid having an effective amount of nitrogen-containing base (e.g., a nitrogen-containing superbase) disposed thereon. Other embodiments of the present invention relate to methods for preparing the aforementioned treated particles; the treated particles themselves; and methods of using the treated particles and compositions of the various embodiments of the present invention.

Treated fillers and uses thereof

The present disclosure provides hydrosilylation curable compositions comprising resin linear organosiloxane block copolymers comprising, among other things, from about 0.5 to about 5 mole % Cto Chydrocarbyl group comprising at least one aliphatic unsaturated bond. Such hydrosilylation curable resin-linear organosiloxane block copolymers have significantly faster cure speed, relative to their condensation curable counterparts. A faster cure speed can be important for encapsulating electronic devices, such as light-emitting diode (LED) chip devices, particularly devices having tall structures.

Growing community of inventors

Midland, MI, United States of America

Yanhu Wei