Toyota Motor Engineering & Manufacturing North America, Inc.

University of Michigan

Yanghe Liu

Shailesh N Joshi

Feng Zhou

Hiroshi Ukegawa

Ercan Mehmet Dede

Chungchih Chou

Ercan Mehment Dede

Qunfang Wu

Mengqi Wang

Weiyang Zhou

Jae Seung Lee

Jongwon Shin

Tianzhu Fan

Shohei Suenaga

Danny J Lohan

Naoya Take

Fa Chen

Hiroshi N Ukegawa

A highly integrated power electronics embedded PCB-cold plate assembly includes a cold plate, a power electronics embedded printed circuit board (PCB), and a low thermal resistance dielectric layer sandwiched between the cold plate and the power electronics embedded PCB. The power electronics embedded PCB is bonded to the cold plate via the low thermal resistance dielectric layer to form highly integrated power electronics embedded PCB—cold plate assembly is formed. And in one example, the low thermal resistance dielectric layer sandwiched between and directly bonded to the cold plate and the power electronics embedded PCB.

Power device embedded printed circuit board-cold plate assemblies with low interfacial thermal and mechanical stresses and methods of making the same

A power device embedded printed circuit board (PCB) assembly includes a cold plate, a multi-layer PCB with at least one power device embedded therein bonded to and in thermal communication with the cold plate, and a chemical vapor deposition (CVD) dielectric layer disposed between the cold plate and the multi-layer PCB. The CVD dielectric layer can be applied to the cold plate and a bonding layer can be sandwiched between the CVD dielectric layer and the multi-layer PCB with at least one power device assembly embedded therein. In the alternative, CVD dielectric layer can be applied top the multi-layer PCB with at least one power device assembly embedded therein and bonding layer can be sandwiched between the CVD dielectric layer and the cold plate.

Power device embedded printed circuit board assemblies with thin film dielectric layers

Systems, methods, and other embodiments described herein relate to charging a battery of an electric vehicle while the electric vehicle is hovering. In one embodiment, a method includes, responsive to determining that an electric vehicle does not include a receiver pad, inserting the receiver pad into the electric vehicle that is hovering in the air at a charging station. The method includes determining a space above a transmitter pad for the electric vehicle to hover based, at least in part, on a location and a size of the transmitter pad. The method includes charging a battery to a threshold value through the receiver pad.

Charging a battery of an electric vehicle hovering in the air

In one embodiment, an electronics assembly includes a cold plate assembly having a first surface, at least one power electronic device disposed within a recess on the first surface of the cold plate assembly, and a printed circuit board disposed on a surface of the at least one power electronic device. The printed circuit board includes a first insulation layer, a second insulation layer, an electrically conductive power layer between the first insulation layer and the second insulation layer, a first set of thermal vias extending from the electrically conductive power layer and toward the first surface of the cold plate assembly, and a second set of thermal vias extending from the first surface of the cold plate assembly toward the electrically conductive power layer. The first set of thermal vias is electrically isolated from the second set of thermal vias.

Electronics assemblies with power electronic devices and three-dimensionally printed circuit boards having reduced joule heating

System, methods, and other embodiments described herein relate to using a printed conductor and a rectifier in the same enclosure for transferring power. In one embodiment, an apparatus includes a conductor, printed on a substrate housed in an enclosure, that generates alternating current caused by a magnetic field emitted by a transmitter, wherein the conductor is a trace spanning layers. The apparatus also includes a rectifier, on a device housed in the enclosure, that receives the alternating current through a terminal connected with the conductor and converts the alternating current to a direct current for powering a load, wherein an insulator between the conductor and the rectifier isolates the magnetic field.

Printed conductor and rectifier package for power transfer

A dynamic wireless power transfer system can include a dynamic wireless power transfer transmission system and a dynamic wireless power transfer reception system. The dynamic wireless power transfer transmission system can include a signal receiver, an array of coils of conductors, an array of switches, and a controller. The dynamic wireless power transfer reception system can include a signal transmitter and an array of coils of conductors. The signal transmitter can be configured to transmit, to the signal receiver, a signal. The signal can include information indicative of a size of the array of coils of conductors of the dynamic wireless power transfer reception system. The array of switches can be configured to connect an alternating current source to the array of coils of conductors of the dynamic wireless power transfer transmission system. The controller can control, according to the information, positions of switches of the array of switches.

Configurable dynamic wireless power transfer transmission system

A transient liquid phase (TLP) composition includes a plurality of first high melting temperature (HMT) particles, a plurality of second HMT particles, and a plurality of low melting temperature (LMT) particles. Each of the plurality of first HMT particles have a core-shell structure with a core formed from a first high HMT material and a shell formed from a second HMT material that is different than the first HMT material. The plurality of second HMT particles are formed from a third HMT material that is different than the second HMT material and the plurality of LMT particles are formed from a LMT material. The LMT particles have a melting temperature less than a TLP sintering temperature of the TLP composition and the first, second, and third HMT materials have a melting point greater than the TLP sintering temperature.

Transient liquid phase bonding compositions and power electronics assemblies incorporating the same

A panel for wireless charging of an electric vehicle includes a metamaterial panel with a first shape and a second shape different than the first shape. The metamaterial panel is configured to be positioned between a transmitter coil of a wireless power transfer station (WPTS) and a receiver coil of the electric vehicle during wireless charging of the electric vehicle and change between the first shape and the second shape as a function of at least one of a size of the transmitter coil, a size of the receiver coil, and a distance between the transmitter coil and the receiver coil. A robot with at least one of a robotic arm and a robotic buggy can be included and the metamaterial panel can be coupled to the robot. And the robot is configured to position the metamaterial panel between the transmitter coil of the WPTS and the receiver coil of the electric vehicle during wireless charging of the electric vehicle.

Metamaterial panel for enhancing wireless charging of electric vehicles

Methods, apparatuses and systems provide technology for a high frequency alternating-current (HFAC) distribution network for a vehicle that includes a plurality of HFAC zones coupled to a direct-current (DC) power source, the plurality of HFAC zones disbursed within the vehicle, where each HFAC zone includes a HFAC resonant inverter to convert DC power to HFAC power and a HFAC bus coupled to the HFAC resonant inverter, the HFAC bus to distribute the HFAC power to one or more loads. The technology includes a CLCL resonant tank circuit having two capacitors and two inductors, a push-pull circuit coupled to the CLCL resonant tank circuit, the push-pull circuit including a pair of switches, and a transformer to couple the inverter to the HFAC bus.

High frequency AC power distribution network for electric vehicles

A wireless charging pad includes a rectifier, a receiver coil, a heat spreader plate sandwich between the rectifier and the receiver coil, and a ferrite cold plate sandwiched between the receiver coil and the heat spreader plate. The ferrite cold plate has a fluid inlet, a fluid outlet, and a fluid chamber in fluid communication with the fluid inlet and the fluid outlet. The fluid chamber includes a primary cooling chamber and a secondary cooling chamber. Primary cooling fins extending from the heat spreader plate are disposed in the primary cooling chamber and secondary cooling fins extending from a base of the ferrite cooling plate are disposed in the secondary cooling chamber. The ferrite cooling plate cools the rectifier and inhibits or blocks electromagnetic leakage from the receiver coil from interfering with operation of rectifier.

Ferrite cold plate for electric vehicle wireless charging

Disclosed herein are apparatus and methods for a power electronics assembly that includes a cold plate assembly and one or more power device assemblies. The cold plate assembly has a manifold having a heat sink cavity in a first surface and a heat sink that includes one or more substrate cavities. The heat sink is positioned in the heat sink cavity. The one or more power device assemblies are positioned within the one or more substrate cavities. Each power device assembly includes an S-cell, a power device, and a direct bonded metal substrate bonded to the S-Cell. The S-cell includes a base layer constructed at least of graphite or a graphite-composite, a conductive layer at least partially surrounding the base layer, and a power device cavity. The power device is positioned in the power device cavity and is electrically coupled to the conductive layer.

Power device assemblies and methods of fabricating the same

Systems and methods are provided for wireless power transfer in a vehicle. A wireless power transfer system can include a high-frequency alternating current (HFAC) inverter electrically coupled to the power source and a transmitter to wirelessly transmit a HFAC power signal to at least one device of a vehicle, such as sensors (e.g., LiDAR, GPS etc.) and cameras. The HFAC power signal provides wireless power and a data signal to the at least one device of a vehicle. The wireless power transfer system can eliminate the need for cabling and wires to provide power to the device. Wireless power transfer can include use or a data modulation circuit and a pulse current source to inject a pulse current to the HFAC power signal as superimposed data. System configurations can power a plurality of devices. Systems can includes a plurality of HFAC inverters and transmitters to power multiple sets of devices.

System and method for wireless power transfer and data modulation for vehicles

Disclosed herein are apparatus and methods for a power electronics assembly includes a cold plate assembly and one or more power device assemblies. The cold plate assembly includes a manifold including a heat sink cavity in a first surface and a heat sink. The heat sink includes one or more substrate cavities and the heat sink is positioned in the heat sink cavity. The one or more power device assemblies are positioned within the one or more substrate cavities. Each power device assembly of the one or more power assemblies includes a direct bonded metal (DBM) substrate including a first metal layer directly bonded to an insulator layer and a power device. The DBM substrate includes a power device cavity. The power device is positioned in the power device cavity and the power device is electronically coupled to the first metal layer.

Power device assemblies having embedded PCBs and methods of fabricating the same

Disclosed herein are power electronics assemblies which include a printed circuit board (PCB) having a plurality of conductive layers and a cold plate contacting the PCB. The cold plate includes a manifold constructed from an electrically insulating material and including a first cavity and a second cavity. The cold plate further includes a first heat sink positioned in the first cavity and thermally coupled to the plurality of conductive layers. The cold plate further includes a second heat sink positioned in the second cavity and thermally coupled to the plurality of conductive layers.

Power electronics assemblies and methods of fabricating the same

An aerial vehicle includes a body and a wireless charging receiver pad connected to the body, whereby the aerial vehicle is configured to be wirelessly charged when parked above a wireless charging transmitter pad. The aerial vehicle includes landing gear connected to the body and extending underneath the body. The landing gear is configured for actuation to control the location of the receiver pad with respect to the transmitter pad.

Growing community of inventors

Ann Arbor, MI, United States of America

Yanghe Liu