Yang Wang

Yongxiang He

Qi Wang

Yuxing Cao

Siva Lanka

Dongseok Kang

The present application relates to the technical field of optical integrated devices, and specifically discloses a semiconductor light source device of optical integrated packaging with high light extraction efficiency and low device heat generation. The semiconductor light source device of optical integrated packaging comprises a substrate, an optical lens, a LED chip and a light transmitting glue layer, the substrate is provided with a circuit, and the optical lens is fixedly connected with the substrate; a light source cavity is provided between the optical lens and the substrate; the LED chip and the light transmitting glue layer are respectively accommodated in the light source cavity; the LED chip is arranged on top of the circuit and electrically connected with the circuit; the light transmitting glue layer is at least arranged on an upper surface of the LED chip; the light transmitting glue layer is used to reduce Fresnel loss when the light of the LED chip is taken out; an outer surface of the light transmitting glue layer is a convex surface, and the convex surface is used to reduce a total reflection loss of a light emitted by the LED chip.

Semiconductor light source device of optical integrated packaging

A VCSEL array and the method of manufacturing the array are disclosed. The VCSEL array comprises a substrate and a plurality of VCSEL structures formed on the substrate in a regular pattern. A customized metal layer is deposited to electrically connect a selected number but not all of the plurality of VCSEL structures. The selected number of VCSEL structures form an array of a predetermined irregular pattern.

Vertical cavity surface emitting laser (VCSEL) array and manufacturing method

The present invention discloses a VCSEL array that can function in at least two different operational modes. In one operational mode, the VCSEL array functions as a regular-patterned array; and in the other operational mode, the VCSEL array functions as an irregular-patterned array. Thus, the same VCSEL chip may be used as an illumination light source or a structural light method light source for 3D sensing, depending on the selected operational mode.

A Vertical Cavity Surface Emitting Laser (VCSEL) array package includes a VCSEL array chip bonded on a substrate, a support structure surrounding the VCSEL array chip, and an optical component mounted on the support structure. The support structure is molded directly on the substrate using a high thermal conductivity molding material. The support structure covers all side surfaces of the VCSEL array chip to facilitate heat transfer through the chip's sides. A transparent layer is deposited on the output surface of the VCSEL array chip, which prevents the support structure from blocking an output beam during molding.

Vertical cavity surface emitting laser (VCSEL) array package and manufacturing method

The present invention discloses a VCSEL array that is divided into at least a first and a second area. The first area covers the center of the array and is surrounded by the second area. The first area would experience higher temperature than the second area after the VCSELs in both areas are turned on for a given time period. VCSELs in the first area are electrically connected to a first metal layer portion. VCSELs in the second area are electrically connected to a second metal layer portion. The first and second metal layer portions are electrically insulated from each other.

Growing community of inventors

Dublin, CA, United States of America

Yang Wang