Lg Display Co., Ltd.

Lg Electronics Inc.

Lg Micron Co., Ltd.

Avaco Co., Ltd.

Yang Sik Moon

Sung Eun Kim

Tae Hyun Lim

Kwang Jong Yoo

Sang Hun Lee

Soon Bog Kwon

Ki Pyo Hong

Yoon Kuen Cho

Hwan Kyu Yoo

Byung Han Yun

Hyun Joo Jeon

Ji Young Oh

Hyuk Sang Yoon

Byeong Cheol An

Jong Bum Jung

A sputtering apparatus for depositing a target material on a substrate includes a chamber, a target in the chamber to provide the target material, a carrier to carry the substrate in the chamber to face the target, and a plurality of masks arranged along sides of the carrier and being movable back and forth with respect to the carrier.

Sputtering apparatus and driving method thereof

A carrier having a plurality of support bars for safely transferring a substrate is provided. The carrier includes a frame having a through-hole formed at a center, the center through-hole including a first inner surface and a second inner surface that faces the first inner surface within in the through-hole; and a plurality of support bars joined to the first inner surface and the second inner surface.

Carrier and manufacturing apparatus having the same

An inclined carrier transferring apparatus for use inline sputtering equipment. The inclined carrier transferring apparatus includes rollers and a guiding portion. The rollers transfer and support the bottom of a carrier. The guiding portion is installed diagonally with respect to the rollers, to support the top of the carrier in a non-contact manner.

Inclined carrier transferring apparatus

There is provided a support platform of a non-contact transfer apparatus. The support platform includes a plurality of first holes for introducing air on a surface of the support platform, and a plurality of second holes for removing the air introduced through the first holes. At least one of a size and a number of the first holes varies in a direction from a central portion of the support platform to peripheral portions of the support platform, and the second holes are identically formed to one another.

Support platform of non-contact transfer apparatus

A method for fabricating a tape substrate includes forming, on an insulating film, a copper foil pattern having a connecting area; coating a solder resist on the formed copper foil pattern, at a region other than the connecting area; plating a barrier layer on the copper foil pattern at the connecting area after the coating of the solder resist; and plating tin on the plated barrier layer plated, thereby forming a tin layer on the barrier layer. Another method for fabricating a tape substrate includes forming, on an insulating film, a copper foil pattern having a connecting area; plating a barrier layer over the formed copper foil pattern; plating tin over the barrier layer after the plating of the barrier layer, thereby forming a tin layer over the barrier layer; and coating a solder resist on the tin layer at a region other than the connecting area, after the formation of the tin layer.

Tape substrate and method for fabricating the same

A tape substrate including an insulating film, a copper foil pattern formed on the insulating film at one side of the insulating film, and provided with a connecting area where an electronic element is to be mounted, a barrier layer plated on the copper foil pattern at the connecting area, and formed with a plurality of pores, and a tin layer plated on the barrier layer, and alloyed with a portion of the copper foil pattern corresponding to the connecting area, through the pores. A method for fabricating the tape substrate is also disclosed. In accordance with the invention, it is possible to reduce the time taken for the copper foil pattern to come into contact with the electroless tin plating solution used in the tin plating process, thereby preventing the copper component of the copper foil pattern from being eluted. Accordingly, there is no open-circuit fault caused by formation of pores. The barrier layer makes it possible to obtain an improved plating efficiency and to reduce the thickness of the alloy layer. In addition, the barrier layer serves to reduce internal stress generated at the interface between the tin layer and the copper foil pattern, thereby suppressing formation of voids. Accordingly, there is an effect of preventing a short circuit caused by the growth of whiskers.

Growing community of inventors

Seoul, South Korea

Yang Sik Moon