Authentec, Inc.

Yang Rao

Dale R Setlak

Matthew M Salatino

Philip J Spletter

Michael Goldenberg

Roger Lee Schenk

Phil Spletter

Phillip Spletter

A method of making finger sensor packages may include advancing a flexible circuit tape along a predetermined path of travel. The flexible circuit tape may include a flexible layer and conductive traces thereon defining individual flexible circuits. The method may include, as the flexible circuit tape is advanced along the path of travel, securing a respective finger sensing integrated circuit (IC) and surrounding sensor package frame to each flexible circuit, applying at least one fluid fill material adjacent each finger sensor IC while using the corresponding sensor package frame as a dam to thereby define finger sensor packages, and stamping out the finger sensor packages from the flexible circuit tape to form at least one flush common edge of each sensor package frame and individual flexible circuit.

Method of making a finger sensor package

A finger sensing device may include a mounting substrate having a recess in a top surface thereof and having conductive through-vias extending from the top surface to a bottom surface. The conductive through-vias may extend laterally adjacent to the recess. The finger sensing device may also include a finger sensing integrated circuit (IC) die within the recess and may include a finger sensing area on a top surface thereof and bond pads on the top surface laterally adjacent the finger sensing area. The finger sensing device may also include a dielectric layer over the mounting substrate and the finger sensing IC die. The finger sensing device may further include a conductive pattern carried by the dielectric layer and coupling the conductive through-vias to respective ones of the bond pads.

Finger sensing device including finger sensing integrated circuit die within a recess in a mounting substrate and related methods

A finger sensor may include a finger sensing integrated circuit (IC) having a finger sensing area and at least one bond pad adjacent thereto, and a flexible circuit coupled to the IC finger sensor. More particularly, the flexible circuit may include a flexible layer, and at least one conductive trace carried thereby and coupled to the at least one bond pad. The sensor may also include at least one Electrostatic Discharge (ESD) electrode carried by the flexible layer. The ESD electrode may be positioned adjacent a beveled edge, for example, of an IC carrier and thereby exposed through a small gap between an adjacent portion of a frame.

Finger sensor including enhanced ESD protection and associated methods

A finger sensor may include a finger sensing integrated circuit (IC) having a finger sensing area and at least one bond pad adjacent thereto, and a flexible circuit coupled to the IC finger sensor. The flexible circuit may include a flexible layer covering both the finger sensing area and the at least one bond pad, and at least one conductive trace carried by the flexible layer and coupled to the at least one bond pad. The flexible layer may permit finger sensing therethrough. The flexible circuit may include at least one connector portion extending beyond the finger sensing area and the at least one bond pad. For example, the connector portion may include a tab connector portion and/or a ball grid array connector portion. A fill material, such as an epoxy, may be provided between the IC finger sensor and the flexible circuit.

Finger sensor including flexible circuit and associated methods

A finger sensor may include a finger sensing integrated circuit (IC) having a finger sensing area, an IC carrier having a cavity receiving the finger sensing IC therein and having at least one beveled upper edge, and a frame surrounding at least a portion of an upper perimeter of the IC carrier and having at least one inclined surface corresponding to the at least one beveled upper edge of the IC carrier. The finger sensor may also include a biasing member for biasing the IC carrier into alignment within the frame. The biasing member may include at least one resilient body for biasing the IC carrier upward within the frame. In other embodiments, the finger sensor may include an IC carrier having a cavity receiving the finger sensing IC therein and having at least one laterally extending projection. The frame may surround at least a portion of an upper perimeter of the IC carrier and have at least one shoulder cooperating with the at least one laterally extending projection of the IC carrier to define at least one upward stop.

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Rockledge, FL, United States of America

Yang Rao