Rivian IP Holdings, LLC

Skyworks Solutions, Inc.

Thrive Market, Inc.

Leviton Manufacturing Company, Inc.

Yang Liu

Steven E Schulz

Ming Li

Thomas Obkircher

Yong Hee Lee

William John Domino

Tyler J Erikson

Mo Lin

Mohammad Sabah

Oleksandr Gorbachov

Lisette L Zhang

Young Mok Doo

Lothar Musiol

Chia-Chou Yeh

Younes Sangsefidi

Lixiang Wei

Vishnu Mohan

Jason Huang

Parham Khajeh Hesamaddin

Zachary C Shiner

Adam Zepeda

Timne Bilton

A flip-chip semiconductor-on-insulator die includes a substrate layer, an active layer, an insulator layer between the substrate layer and the active layer, a first metal layer, and a first via layer between the active layer and the first metal layer. The die at least first and second contact pads and a transistor including a first terminal formed within the active layer. A first portion of the first terminal falls within a footprint of the first contact pad and a second portion of the first terminal falls within a footprint of the second contact pad.

Flip-chip semiconductor-on-insulator transistor layout

A direct current fast charge (DCFC) system and associated method that lower standby power dramatically when the DCFC system is not in operation, and that provide a reset capability for communication needs. The DCFC system utilizes an appropriate load disconnection switch and an associated control and communication circuit, timer circuit, and automatic turn on system. This improves the reliability of the electronics by removing voltage stress during the standby mode. The DCFC system prevents energy waste, and therefore provides a 'green' alternative to conventional DCFC systems.

Direct current fast charger system with low standby power

Various disclosed embodiments include illustrative controller modules, direct current (DC) fast charging devices, and methods. In an illustrative embodiment, a controller module for a DC-DC converter includes a controller and computer-readable media configured to store computer-executable instructions configured to cause the controller to receive an input voltage Vto the DC-DC converter, receive an output DC voltage Vfrom the DC-DC converter, generate control signals configured to control a charging output of the DC-DC converter responsive to the received input voltage Vand output voltage V, and output the generated control signals to the DC-DC converter.

Controllers, devices, and methods for controlling direct current fast charging devices

A semiconductor-on-insulator die can include a power amplifier configured to amplify a radio frequency input signal having a fundamental frequency. The die can further include an output matching circuit including first and second second-order harmonic rejection circuits configured to resonate at about two times the fundamental frequency and a third order harmonic rejection circuit configured to resonate at about three times the fundamental frequency.

Power amplifier output matching

A lighting apparatus that includes a housing having first and second sidewalls, a top housing wall disposed between the first and second sidewalls, and an open end disposed between the sidewalls and opposite the top housing wall. The housing includes a housing interior enclosed by the sidewalls and the top housing wall. The apparatus includes a lighting lens housing having a first and second lens sidewalls and a lens panel disposed between the lens sidewalls, where the lighting lens housing has a lens interior. The lens sidewalls block transmission of light. The lighting lens housing is removably secured within the housing interior, wherein, upon removably securing the lighting lens housing within the housing interior, at least one of the first and second lens sidewalls is positioned at an offset and adjacent the open end of the housing.

Lighting fixture systems

A low-voltage distribution board and a direct current fast charging (DCFC) system including the low-voltage distribution board are provided. The DCFC system includes a power supply and a plurality of loads connected by a serial bus. The low-voltage distribution board includes a first input connector configured to receive power from the first power supply, and a first plurality of output connectors configured to be connected to the first plurality of loads. The low-voltage distribution board further includes a first current distribution circuit configured to provide, through the first plurality of output connectors, the received power from the first power supply to the first plurality of loads, and an identification (ID) assignment circuit configured to provide, through the first plurality of output connectors, different ID values to each of the first plurality of loads.

Smart harness management for low-voltage distribution

Various disclosed embodiments include illustrative controller units, direct current fast charging (DCFC) units, and methods. In an illustrative embodiment, a controller unit includes a controller and a memory configured to store computer-executable instructions. The computer-executable instructions are configured to cause the controller to determine status of a power electronics module (PEM) of a direct current fast charging (DCFC) unit, and instruct the PEM to control power quality of a three-phase alternating current (AC) grid power signal in response to the determined status being available.

Controllers, devices, and methods for performing power quality control using direct current fast charging devices

Embodiments of the present disclosure provide for improved management, selection, and provision of network asset data objects. For example, embodiments described throughout are configured to score various network assets corresponding to real-world assets, items, products, and/or the like, for selection and provision associated with one or more particular user profile identifiers. Embodiments are configured to train network asset scoring model(s) based on specific data, such as prioritized network asset data set(s), such that the trained network asset scoring model(s) efficiently generate more accurate, improved scores for network asset data objects. Additional or alternative embodiments are configured to provide data tagged network asset set(s) utilizing specially trained model(s), such as one or more multi-armed bandit models and/or one or more network asset scoring model(s).

Apparatuses, computer-implemented methods, and computer program products for improved management, selection, and provision of network asset data objects

Systems and methods for controlling a dual active bridge converter are disclosed herein. An output voltage of a dual active bridge converter is sensed. Based at least in part on the output voltage, a target intra-bridge phase shift amount between two bridges of the dual active bridge converter is computed. A plurality of switch control signals, which are provided to respective switches of the dual active bridge converter, are caused to switch according to a time-based switching sequence based on the target intra-bridge phase shift amount to compensate for variations in the output voltage.

Dual active bridge converter control with intra-bridge phase shift

A semiconductor-on-insulator die includes a substrate layer, an active layer, an insulator layer between the substrate layer and the active layer, a first metal layer, and a first via layer between the active layer and the first metal layer. The die includes at least one contact pad and a transistor including a first terminal formed within the active layer. A conduction path can include a plurality of first conduction path portions extending between the first terminal and the at least one contact pad and residing within a footprint of the at least one contact pad.

Semiconductor-on-insulator transistor layout for radio frequency power amplifiers

A power electronics module for an industrial or vehicle battery charger system or the like is provided. The power electronics module utilizes a chassis housing including a heatsink surface and a plurality of sidewalls. A main power section printed circuit board is disposed adjacent to the heatsink surface of the chassis housing a. A low voltage, low power printed circuit board is disposed adjacent to the main power section printed circuit board opposite the heatsink surface of the chassis housing. An alternating current input filter portion printed circuit board including electromagnetics is disposed along one of the plurality of sidewalls of the chassis housing and separated from the low voltage, low power printed circuit board within the chassis housing.

Growing community of inventors

Irvine, CA, United States of America

Yang Liu