Western Digital Technologies, Inc.

Sandisk Technologies Inc.

Shanghai Wd Pharmaceutical Co., Ltd

Yang Lei

Junrong Yan

Gang Wu

Chee Keong Chin

Weili Wang

Zhonghua Qian

Liang Chang Dong

Xiaofeng Di

Jingmin Shi

Yan Jiao

Yuyun Lou

Xin Tian

Semiconductor dies formed on a wafer may be picked from the wafer with little or no stress, thus preventing cracking and damage to the semiconductor dies. A die attach film (DAF) layer is laminated onto an inactive surface of the wafer and the DAF layer is cut in the outline of the dies. The inactive surface of the wafer may then be supported on a vacuum chuck without using a dicing tape, and dies transferred from the wafer using a pick and place robot.

Semiconductor device with reduced stress die pick and place

Disclosed is an oral drug delivery device, comprising a tubular member, a drug holding part, a device cap and a turbulence-creating means. The tubular member has openings at both ends and an inner cavity; the opening at one end is a first opening and the opening at the other end is a second opening; the inner cavity communicates the first opening and the second opening. The turbulence-creating means comprises a step structure or a fold structure, and is disposed in the inner cavity and positioned between the second opening and the drug holding part. By using the oral drug delivery device of the present invention, turbulence can be generated during a normal sipping process, thereby providing ample mixing of drug-containing granules or multi-particulates with drinkable liquids. Moreover, the device is telescopic, which reduces the size and is convenient to carry.

Oral drug delivery device

A semiconductor device includes an integrated circuit die having bond pads and a bond wires. The bond wires are connected to respective ones of the bond pads by a ball bond. An area of contact between the ball bond and the bond pad has a predetermined shape that is non-circular and includes at least one axis of symmetry. A ratio of the ball bond length to the ball bond width may be equal to a ratio of the bond pad length to the bond pad width.

Wire bonding for semiconductor devices

Growing community of inventors

Shanghai, China

Yang Lei