Intel Corporation

Yang Jiao

Edvin Cetegen

Dingying David Xu

Michael L Rutigliano

Kuang C Liu

Kelly P Lofgreen

Joseph B Petrini

Todd R Coons

Christopher Wade Ackerman

Patrick Nardi

Prasanna Raghavan

John Harper

Sanjoy Saha

Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate, and a die coupled to the package substrate. In an embodiment, the electronic package further comprises a stiffener on the package substrate surrounding the die. In an embodiment, the stiffener is a ring with one or more corner regions and one or more beams. In an embodiment, each beam is between a pair of corner regions, and the one or more corner regions have a first thickness and the one or more beams have a second thickness that is greater than the first thickness.

BGA stiffener attachment with low Eolife adhesive strength at high solder joint stress area generated from enabling load

A conformable heat sink interface for an integrated circuit package comprises a mounting plate having a first surface and a deformable membrane having a portion bonded to a second surface of the plate. A cavity is between the second surface of the plate and the deformable membrane. A flowable heat transfer medium is within the cavity. The flowable heat transfer medium has a thermal conductivity of not less than 30 W/m K. The deformable membrane is to conform to a three-dimensional shape of an IC package and the mounting plate has a second surface that is to be adjacent to a heat sink base.

Conformable heat sink interface with a high thermal conductivity

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Chandler, AZ, United States of America

Yang Jiao