Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Yang-Je Lee

Yong-jin Kim

Young-ho Lee

Jung-Hyeon Kim

Do-hyung Kim

Dek-Gin Yang

Hyo-Jae Bang

Hyun-Seok Choi

Yong-Hyun Kim

Kyoung-Sun Kim

Byoung-Ho Rhee

Jung-Chan Cho

Bum-Young Myoung

Jae-Sang Baik

A stacked semiconductor module, a method of fabricating the same, and an electronic system using the module are provided. A first semiconductor module having a plurality of semiconductor devices mounted on a rigid printed circuit board (PCB) and a second semiconductor module having a plurality of other semiconductor devices mounted on a flexible PCB are provided. On the rigid PCB a number L of first tabs may be disposed on a first surface, and a number K of second tabs may be disposed on a second surface of the rigid PCB. The flexible PCB may have a number M of third tabs on a third surface, and a number N of fourth tabs on a fourth surface of the flexible PCB. The second tabs may be combined with the third tabs using a conductive adhesive. The third tabs may be electrically connected to corresponding ones of the second tabs.

Stacked semiconductor module, method of fabricating the same, and electronic system using the same

Disclosed herein are a brown oxide pretreatment composition for cleaning a copper surface and improving adhesion of a polyimide surface, and a method for improving adhesion of a polyimide surface by applying the composition to a brown oxide process. The brown oxide pretreatment composition for cleaning a copper surface and improving adhesion of a polyimide surface comprises, 5&#x2dc;15 g/L of an amine; 190&#x2dc;210 g/L of a hydroxide compound; at least one additive selected from 3&#x2dc;6 g/L of a cleaner adjuvant, 0.1&#x2dc;5 g/L of a antifoaming agent and 1&#x2dc;10 g/L of a precipitation inhibitor; and the balance of water. When the brown oxide pretreatment composition for cleaning a copper surface and improving adhesion of a polyimide surface is applied to a pretreatment step of a brown oxide process, it can clean a copper surface and improve adhesion of a polyimide surface.

Brown oxide pretreatment composition for cleaning copper surface and improving adhesion of polyimide surface, and method for improving adhesion of polyimide surface by applying the same to brown oxide process

Growing community of inventors

Cheongju-si, South Korea

Yang-Je Lee