Infineon Technologies Ag

Infineon Technologies LLC

Yang Hong Heng

Kean Cheong Lee

Ralf Otremba

Xaver Schloegel

Juergen Schredl

Robert-Christian Hagen

Soon Hock Tong

Fong Lim

Chai Wei Heng

Gerhard Deml

Yong Chern Poh

Boon Kian Lim

Alvin Wee Beng Tatt

See Yau Lee

Fuaida Harun

A semiconductor chip assembly includes a semiconductor chip and a pyrolytic graphite element that is an electrode that is electrically connected to and provides electrical conduction of current from the chip during operation of the chip.

Semiconductor chip assembly

Embodiments provide an electronic device including a leadframe, a chip attached to the leadframe, and encapsulation material disposed over a portion of the leadframe. The leadframe includes a first main face opposite a second main face and a plurality of edges extending between the first and second main faces. At least one of the plurality of edges includes a first profiled element and a second profiled element different than the first profiled element. The encapsulation material is disposed over the chip and the plurality of edges of the leadframe.

Electronic device having profiled elements extending from planar surfaces

Semiconductor module for a Switched-Mode Power Supply comprises at least one semiconductor power switch, a control semiconductor chip and a leadframe comprising a die pad and a plurality of leads disposed on one side of the die pad. The die pad comprises at least two mechanically isolated regions wherein the semiconductor power switch is mounted on a first region of the die pad and the control semiconductor chip is mounted on a second region of the die pad. Plastic housing material electrically isolates the first region and the second region of the die pad and electrically isolates the semiconductor power switch from the control semiconductor chip.

Semiconductor module for a switched-mode power supply and method for its assembly

An electronic component includes a lead frame, a semiconductor chip and an encapsulating body. The lead frame includes a heat spreader area, a plurality of conductive lead fingers, at least one non-conductive tie bar, and a metal joint. The metal joint connects the at least one non-conductive tie bar to the heat spreader area. The semiconductor chip is provided on a die pad located on the heat spreader area. The encapsulating body covers at least part of the semiconductor chip, at least part of the at least one non-conductive tie bar and part of the lead frame.

Lead frame with non-conductive connective bar

There is provided a method of making an encapsulated component package, including providing a support for supporting the components of the package during encapsulation, the support including legs extending beyond the perimeter of the final package, rupturing the support legs, and covering the exposed ends of the legs with an insulating material. There is also provided a package formed in accordance with the method.

Method of manufacture of encapsulated package

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Johor, Malaysia

Yang Hong Heng