Samsung Electro-mechanics Co., Ltd.

Yang Ho Moon

Jung Eun Noh

Dae Hyeong Lee

Doo Yeoul Yang

Hong Wook Kim

Sung Woon Dong

Seung Su Park

There is provided a camera module package. A camera module package according to an aspect of the invention includes a bonding unit at an inner surface of a housing including an optical system and a filter adhered to the bonding unit by an adhesive. Here, the bonding unit corresponding to the filter has a longitudinal central region corresponding to a gate and an overflow unit of a runner hardening unit provided when the housing is injection molded, and left and right regions while the longitudinal central region has a smaller surface height than each of the left and right regions, and the adhesive provided between the bonding unit and the filter has a predetermined thickness so that maximum thermal stress generated in the housing has a relatively smaller value than adhesive strength of the adhesive.

Camera module package

A lens module includes a first lens, a second lens, a spacer, a seating part, and a protrusion part. The first lens includes a lens surface and a rib. The second lens is laminated on the first lens. The spacer maintains a predetermined interval between the first lens and the second lens. The seating part is disposed between the lens surface of the first lens and the rib and allows the spacer to be seated on the upper part of the first lens. The protrusion part includes a plurality of protrusions protruded from an undersurface of the spacer, which allow a height of the spacer seated on the seating part to change when the spacer is decentered.

Lens module

A crystal oscillator with an improved shock resistance is disclosed. A pair of supporting protuberances protrude within an oscillator main body. A conductive adhesive is spread on the pair of the supporting protuberances, and a quartz blank is bonded to the supporting protuberances across the conductive adhesive. Further, an insulating resin layer is disposed between the quartz blank and a cover so as to elastically press down the conductive adhesive. Further, the length of the connecting parts between the supporting part and the bridge parts is more extended to a certain degree, so that any stress imposed on them can be dispersed.

Growing community of inventors

Gyunggi-do, South Korea

Yang Ho Moon