Amkor Technology, Inc.

Amkor Technology Singapore Holding Pte. Ltd.

Yang Gyoo Jung

Min Ho Kim

Choong Hoe Kim

Dong Soo Ryu

Youn Seok Song

Tae Ho Yoon

Choon Heung Lee

Ju Hoon Yoon

Chan Ha Hwang

Dong Su Ryu

A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.

Laser-assisted bonding apparatus for bonding an electronic device to a substrate

System and method for laser assisted bonding of an electronic device

System and method for laser assisted bonding of semiconductor die

Laser assisted bonding for semiconductor die interconnections is disclosed and may, for example, include forming flux on a circuit pattern on a circuit board, placing a semiconductor die on the circuit board where a bump on the semiconductor die contacts the flux, and reflowing the bump by directing a laser beam toward the semiconductor die. The laser beam may volatize the flux and make an electrical connection between the bump and the circuit pattern. A jig plate may be placed on the semiconductor die when the laser beam is directed toward the semiconductor die. Warpage may be reduced during heating or cooling of the semiconductor die by applying pressure to the jig plate. Jig bars may extend outward from the jig plate and may be in contact with the circuit board during the application of pressure to the jig plate. The jig plate may comprise one or more of: silicon, silicon carbide, and glass.

Laser assisted bonding for semiconductor die interconnections

Growing community of inventors

Seoul, South Korea

Yang Gyoo Jung