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Carlsbad, CA, United States of America

Yang Du

Average Co-Inventor Count = 2.24

ph-index = 7

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 221

Yang DuKambiz Samadi (16 patents)Yang DuJing Xie (10 patents)Yang DuPratyush Kamal (9 patents)Yang DuShreepad Amar Panth (6 patents)Yang DuSung Kyu Lim (6 patents)Yang DuRobert P Gilmore (4 patents)Yang DuShiqun Gu (3 patents)Yang DuYu Pu (3 patents)Yang DuWilliam Xia (2 patents)Yang DuYong Ju Lee (2 patents)Yang DuJe-Hsiung Lan (1 patent)Yang DuVladimir Aparin (1 patent)Yang DuAmin Ansari (1 patent)Yang DuKarim Arabi (1 patent)Yang DuGiby Samson (1 patent)Yang DuRatibor Radojcic (1 patent)Yang DuJavid Jaffari (1 patent)Yang DuDavid Bang (1 patent)Yang DuKaramvir Chatha (1 patent)Yang DuWenyue Lydia Zhang (1 patent)Yang DuJayakannan Jayapalan (1 patent)Yang DuYang Du (41 patents)Kambiz SamadiKambiz Samadi (17 patents)Jing XieJing Xie (10 patents)Pratyush KamalPratyush Kamal (16 patents)Shreepad Amar PanthShreepad Amar Panth (6 patents)Sung Kyu LimSung Kyu Lim (6 patents)Robert P GilmoreRobert P Gilmore (39 patents)Shiqun GuShiqun Gu (125 patents)Yu PuYu Pu (14 patents)William XiaWilliam Xia (11 patents)Yong Ju LeeYong Ju Lee (7 patents)Je-Hsiung LanJe-Hsiung Lan (81 patents)Vladimir AparinVladimir Aparin (57 patents)Amin AnsariAmin Ansari (23 patents)Karim ArabiKarim Arabi (18 patents)Giby SamsonGiby Samson (16 patents)Ratibor RadojcicRatibor Radojcic (14 patents)Javid JaffariJavid Jaffari (9 patents)David BangDavid Bang (6 patents)Karamvir ChathaKaramvir Chatha (5 patents)Wenyue Lydia ZhangWenyue Lydia Zhang (4 patents)Jayakannan JayapalanJayakannan Jayapalan (2 patents)
..
Inventor’s number of patents
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Strength of working relationships

Company Filing History:

1. Qualcomm Incorporated (41 from 41,326 patents)


41 patents:

1. 11733766 - Ultra-low power neuromorphic artificial intelligence computing accelerator

2. 11609623 - Ultra-low power neuromorphic artificial intelligence computing accelerator

3. 11004780 - Hard macro having blockage sites, integrated circuit including same and method of routing through a hard macro

4. 10578497 - Diode-based temperature sensor

5. 10510651 - Hard macro having blockage sites, integrated circuit including same and method of routing through a hard macro

6. 10192813 - Hard macro having blockage sites, integrated circuit including same and method of routing through a hard macro

7. 10176147 - Multi-processor core three-dimensional (3D) integrated circuits (ICs) (3DICs), and related methods

8. 10121743 - Power distribution networks for a three-dimensional (3D) integrated circuit (IC) (3DIC)

9. 10062680 - Silicon-on-insulator (SOI) complementary metal oxide semiconductor (CMOS) standard library cell circuits having a gate back-bias rail(s), and related systems and methods

10. 10038060 - Graphene NMOS transistor using nitrogen dioxide chemical adsorption

11. 9929733 - Connection propagation for inter-logical block connections in integrated circuits

12. 9922956 - Microelectromechanical system (MEMS) bond release structure and method of wafer transfer for three-dimensional integrated circuit (3D IC) integration

13. 9869713 - Through-silicon via (TSV) crack sensors for detecting TSV cracks in three-dimensional (3D) integrated circuits (ICs) (3DICs), and related methods and systems

14. 9773741 - Bondable device including a hydrophilic layer

15. 9754923 - Power gate placement techniques in three-dimensional (3D) integrated circuits (ICs) (3DICs)

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12/4/2025
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