At&s (chongqing) Company Limited

Tongwei Solar (chengdu) Co., Ltd.

Hitgen, Inc.

Yang Chen

Jinqiao Wan

Dengfeng Dou

Yong Wang

Zhi Wang

Guansai Liu

Xuebing Wan

Yanxu Chen

Tao Lin

Jianbin Fan

Xiajie Meng

Xincheng Liu

Yun Mu

A metal-semiconductor contact structure is provided. The metal-semiconductor contact structure includes a doped silicon-based semiconductor layer and a metal electrode in contact with each other. A contact region between the doped silicon-based semiconductor layer and the metal electrode includes a first conductive region and a second conductive region. In the first conductive region, the metal electrode is recessed towards an inner direction of the doped silicon-based semiconductor layer to form a pit island, a silicon-based eutectic in conductive connection with the doped silicon-based semiconductor layer is provided in the pit island, and a conductive crystal in conductive connection with the silicon-based eutectic is provided. A conductive aggregate including a glass phase material and metal conductive particles is provided in the second conductive region, and the metal conductive particles have a same kind of the metal element as the conductive crystal.

Metal-semiconductor contact structure and preparation method therefor, solar cell, solar cell string and preparation method therefor, and photovoltaic module

A method for manufacturing a component carrier. The method includes (a) supplying a semifinished or finished component carrier to an automatic or semi-automatic optical inspection device and (b) performing an automatic or semi-automatic optical inspection by capturing a first image with a first illumination; capturing a second image with a second illumination; comparing a data set indicative of the first image and/or the second image with a reference data set; and identifying potential defects; (c) performing a quality classification of the semifinished or finished component carrier by generating a virtual third image indicative of the component carrier under a virtual different third illumination having a third spectral composition different from both the first spectral composition and from the second spectral composition; processing the three images; classifying the potential defects in true defects and false defects; and (d) taking action based on the quality classification. Further described is a system architecture.

Manufacturing method of a component carrier, handling system, computer program and system architecture

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Chengdu, China

Yang Chen