Apple Inc.

Western Digital (fremont), Inc.

Yanfeng Chen

Shankar S Pennathur

Meng Chi Lee

Lan H Hoang

Mandar Painaik

Zhongyan Wang

Yunfei Li

Ming Jiang

Mirzafer K Abatchev

Richard M Mank

Phillip R Sommer

Matthew R Gibbons

Ge Yi

Hongxing Yuan

Yufeng Hu

Shakti Singh Chauhan

Lili Huang

Dujiang Wan

Guanghong Luo

Zhong Shi

Wei Gao

Wentao Yan

Ming M Yang

Shawn M Tanner

Lily Yao

Yunjun Tang

Lijie Zhao

Yana Qian

Paul E Anderson

A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and depositing one or more layers of a multi-layer thin film stack on the insulating layer and filling the trenches. In some examples, the multi-layer thin film stack can include an adhesion layer, a shielding layer, a protection layer, and a cosmetic layer. In some examples, the multi-layer thin film stack can include multi-functional layers such as a protection and cosmetic layer.

Multi-layer thin-film coatings for system-in-package assemblies in portable electronic devices

System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.

System-in-package including opposing circuit boards

Electrical components may be packaged using system-in-package configurations or other component packages. Integrated circuit dies and other electrical components may be soldered or otherwise mounted on printed circuits. A layer of encapsulant may be used to encapsulate the integrated circuits. A shielding layer may be formed on the encapsulant layer to shield the integrate circuits. The shielding layer may include a sputtered metal seed layer and an electroplated layer of magnetic material. The electroplated layer may be a magnetic material that has a high permeability such as permalloy or mu metal to provide magnetic shielding for the integrated circuits. Integrated circuits may be mounted on one or both sides of the printed circuit. A temporary carrier and sealant may be used to hold the encapsulated integrated circuits during electroplating.

System-in-package devices with magnetic shielding

A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and conformally coating the insulating layer and trenches with a metal shielding layer. In some examples, trenches between subsystems can be formed using a laser source. In some examples, trenches between subsystems can have angled walls. In some examples, the metal shielding layer can be formed using at least one of electroplating, electroless plating, chemical vapor deposition, and physical vapor deposition.

Shielding structures for system-in-package assemblies in portable electronic devices

A method for improving the lithium cobalt oxide (LiCoO2) film (such as films in thin film batteries) morphology includes using oxygen (O2) and argon (Ar) gases during sputtering deposition of the LiCoO2 film. This may allow for the manufacturing of thicker LiCoO2 films. Such a method may also significantly reduce or eliminate cracking and obvious columnar structures within the resulting LiCoO2 film layer. Sputtering using a mixture of O2 and Ar also may produce a LiCoO2 film layer that requires lower annealing temperatures to reach good utilization and has higher lithium diffusion rates.

[object Object]

Damascene processes using physical vapor deposition (PVD) sputter carbon film as a chemical mechanical planarization (CMP) stop layer for forming a magnetic recording head are provided. In one embodiment, one such process includes providing an insulator, removing a portion of the insulator to form a trench within the insulator, depositing a carbon material on first portions of the insulator using a physical vapor deposition process, disposing at least one ferromagnetic material on second portions of the insulator to form a pole including a portion of the ferromagnetic material within the trench, and performing a chemical mechanical planarization on the at least one ferromagnetic material using at least a portion of the carbon material as a stop for the chemical mechanical planarization.

Damascene process using PVD sputter carbon film as CMP stop layer for forming a magnetic recording head

Embodiments of the present invention relate to reducing the size variation on a wafer fabrication. In some embodiments, at least a portion the backfill material over features larger than a threshold size is etched or milled to provide backfill protrusions over those features. The backfill protrusions are configured to reduce the size variation across the fabrication. Embodiments of the invention may be used in fabrication of many types of devices, such as tapered wave guides (TWG), near-field transducers (NFT), MEMS devices, EAMR optical devices, optical structures, bio-optical devices, micro-fluidic devices, and magnetic writers.

Process for CMP with large feature size variation

A method provides an EAMR transducer. The EAMR transducer is coupled with a laser and has an ABS configured to reside in proximity to a media during use. The EAMR transducer includes an NFT for focusing the energy onto the media. A sacrificial layer is deposited on the NFT and a mask having an aperture provided on the sacrificial layer. A portion of the sacrificial layer exposed by the aperture is removed to form a trench above the NFT. A heat sink is then provided. At least part of the heat sink resides in the trench. The heat sink is thermally coupled to the NFT. Optical material(s) are provided around the heat sink. A write pole configured to write to a region of the media is also provided. The write pole is thermally coupled with the top of the heat sink. Coil(s) for energizing the write pole are also provided.

Method and system for providing an energy assisted magnetic recording writer having a heat sink and NFT

Embodiments of the present invention are directed to a recording head for energy assisted magnetic recording. The recording head includes a near-field transducer (NFT) having a preselected shape and a surface, a writing pole on the NFT, and a non-metal heat dissipator positioned between the NFT surface and the writing pole. The non-metal heat dissipator includes a first portion in contact with the NFT surface, the first portion extending beyond an edge of the NFT surface in a first direction substantially perpendicular to an air bearing surface (ABS) and parallel to the NFT surface.

Systems and methods for dissipating heat from a near-field transducer in an energy assisted magnetic recording assembly

Growing community of inventors

San Ramon, CA, United States of America

Yanfeng Chen