Sumida Electric (h.k.) Company Limited

General Electric Company

Other

Yanfei Liu

Douglas James Malcolm

Christopher Fred Keimel

Glenn Scott Claydon

Christian Michael Giovanniello, Jr

Hongnian Zhang

Guoping Zhang

Zhuo Wu

Hongliang Wang

Xinliang Luo

Christian Michael Giovanniello

A power supply module is disclosed. The power supply module includes: a coil including a coil body and connecting ends; electronic components including at least an integrated circuit chip; a magnetic core which encloses the coil body, wherein at least one side of the magnetic core has a cavity provided therein, and the at least one electronic component is positioned in the cavity; a connector, which abuts against the side of the magnetic core having the cavity therein, covers the surface of the side, and is electronically connected to the coil and the electronic components. The power supply module is able to reduce the damage to the integrated circuit chip, decrease electromagnetic interferences and achieve an excellent cooling effect.

Power supply module

A switching system includes a MEMS switching circuit having a MEMS switch and a driver circuit. An auxiliary circuit is coupled in parallel with the MEMS switching circuit, the auxiliary circuit comprising first and second connections that connect the auxiliary circuit to the MEMS switching circuit on opposing sides of the MEMS switch, first and second solid state switches connected in parallel, and a resonant circuit connected between the first and second solid state switches. A control circuit controls selective switching of a load current towards the MEMS switching circuit and the auxiliary circuit by selectively activating the first and second solid state switches and the resonant circuit so as to limit a voltage across the MEMS switch by diverting at least a portion of the load current away from the MEMS switch to flow to the auxiliary circuit prior to the MEMS switch changing state.

Auxiliary circuit for micro-electromechanical system relay circuit

A power supply module and a method for manufacturing the same are disclosed. The power supply module includes: a coil including a coil body and a connecting terminal; electronic components at least including an integrated circuit chip; a connector configured to be electrically connected with the coil and the electronic component; and a magnetic conductor configured to enclose in and around the coil body and the electronic component, wherein the connector is integrally formed with the integrated circuit chip when manufacturing the latter. The present disclosure can make the structure of the power supply module be more compact to further meet the needs of miniaturization design, reduce material consumption, simplify procedure, and therefore reduce the production costs.

A switching system includes a MEMS switching circuit having a MEMS switch and a driver circuit, and an auxiliary circuit coupled in parallel with the MEMS switching circuit that comprises solid state switching circuitry. A control circuit in communication with the MEMS switching circuit and the auxiliary circuit performs selective switching of a load current towards the MEMS switching circuitry and the auxiliary circuit, with the control circuit programmed to transmit a control signal to the driver circuit to cause the MEMS switch to actuate to an open or closed position across a switching interval, activate the auxiliary circuit during the switching interval when the MEMS switch is switching between the open and closed positions, and deactivate the auxiliary circuit upon reaching the open or closed position after completion of the switching interval, such that the load current selectively flows through the MEMS switch and the solid state switching circuitry.

Micro-electromechanical system relay circuit

A switching system includes a control circuit that receives On-Off signals indicative of a desired operating state of a switch. The control circuit includes an oscillator that generates a first electrical pulse responsive having a first signal characteristic or a second signal characteristic that is determined by the received On-Off signal, which may be related to a frequency or duty cycle of the pulse. A pulse transformer connected to the oscillator receives the first electrical pulse and outputs a second electrical pulse having the same one of the first signal characteristic and the second signal characteristic as the first electrical pulse. A pulse detection circuit in the control circuit receives the second electrical pulse, determines whether the second electrical pulse has the first signal characteristic or the second signal characteristic, and controls transmission of power and control signals to the switch based on this determination.

Isolated control circuit and driver for micro-electromechanical system switch

Five-level topology units and inverters based on the five-level inverter units without a boost circuit. Cost is reduced by using only one AC filtering inductor and high efficiency is achieved in the absence of an extra boosting circuit. Leakage current is eliminated substantially by using a half-bridge inverter module. A five-level inverter including a five-level topology unit without a boost circuit to raise the input voltage is able to output the same AC power as a five-level full bridge inverter under the same working condition.

Five-level topology units and inverter thereof

A power supply module and its manufacturing method are disclosed. The manufacturing method for the power supply module includes: configuring a coil such that coil terminals are configured by way of electrical connection in the preset circuit connection configuration of the connector; preparing a mold cavity, and placing the connector housed with the coil and the electronic components into the mold cavity; making a magnetic mixture, and filling the mold cavity where the connector is placed with the magnetic mixture to form a magnetic body under pressure, wherein the magnetic body encapsulates at least the coil, the electronic components and a portion of the connector adapted to house the coil and the electronic components, and the terminal is exposed outside the magnetic body; demolding the magnetic body from the mold cavity; and increasing the temperature of the demolded magnetic body by heating. In this way, the molding pressure for forming the power supply module is lower and the manufactured power supply module has good performance of heat transfer.

Manufacturing method for a power supply module

A coil with variable inner diameter is disclosed. The coil includes a coil body consisting of a plurality of turns of winding, and a connecting terminal configured to be connected to an external device, wherein the winding is wound to form at least two different inner diameters. And an electronic module made from the coil with variable inner diameter is also disclosed. The electronic module includes: electronic components including at least an integrated circuit chip; a coil with variable inner diameter, including a coil body having at least two different inner diameters and a connecting terminal; a connector, configured to be electrically connected with the electronic component and the coil; and a magnetic conductor, configured to enclose in and around the coil body and the electronic component.

Coil with variable inner diameter and electronic module made from the coil

A power supply module is disclosed. the power supply module includes a coil including a coil body and connecting terminals; an electronic component including at least an integrated circuit chip; a magnetic core configured to enclose in and around the coil body, wherein a recess is provided on at least one side surface of the magnetic core, the electronic components are located in the recess, and an opening is provided on at least one side wall of the recess; a connector configured to be tightly attached to and cover the side surface where the recess is provided, and be electrically connected with the coil and the electronic component; and a heat conducting material provided in the recess and configured to cover the electronic component.

Growing community of inventors

Kingston, Canada

Yanfei Liu