Hewlett-packard Development Company, L.p.

Purdue Research Foundation

Applied Materials, Inc.

Yan Zhao

Lihua Zhao

Hou Tee Ng

Howard S Tom

Sivapackia Ganapathiappan

Krzysztof Nauka

Jianguo Mei

Aja Hartman

Jun Zeng

Kristopher J Erickson

Alexander N Govyadinov

Fred Conrad Redeker

Vladek P Kasperchik

Nag B Patibandla

Rajeev Bajaj

Wei T Huang

Daniel Redfield

James Elmer Abbott, Jr

Ashavani Kumar

Boyi Fu

Ashwin Chockalingam

Ranga Rao Arnepalli

Mario Dagio Cornejo

Amritanshu Sinha

Albert Teishev

Alejandro Manuel De Pena

Keshava A Prasad

Sterling Chaffins

Kevin P Dekam

Eric G Hanson

Andrew E Fitzhugh

Sebastia Cortes I Herms

Alexander Wei

Doris Chun

Paul Olubummo

Scott White

Elias I Franses

Hokeun Kim

David S Corti

Yung-Jih Yang

In one example, a non-transitory processor readable medium having instructions thereon that when executed cause an additive manufacturing machine to expose build material to a light source emitting monochromatic light within a band of wavelengths that includes a peak light absorption of a liquid coalescing agent to be dispensed on to the build material.

Lighting for additive manufacturing

Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.

Integrated abrasive polishing pads and manufacturing methods

In an example method for forming three-dimensional (3D) printed electronic parts, a build material is applied. An electronic agent is selectively applied in a plurality of passes on a portion of the build material. A fusing agent is also selectively applied on the portion of the build material. The build material is exposed to radiation in a plurality of heating events. During at least one of the plurality of heating events, the portion of the build material in contact with the fusing agent fuses to form a region of a layer. The region of the layer exhibits an electronic property. An order of the plurality of passes, the selective application of the fusing agent, and the plurality of heating events is controlled to control a mechanical property of the layer and the electronic property of the region.

Forming three-dimensional (3D) electronic parts

In one example, a lighting device for an additive manufacturing machine includes an array of light sources each to emit monochromatic light within a band of wavelengths that includes a peak light absorption of a liquid coalescing agent to be dispensed on to a build material.

In an example implementation, a method of printing a multi-structured three-dimensional (3D) object includes forming a layer of sinterable material. The method includes processing a first portion of the sinterable material using a first set of processing parameters and processing a second portion of the sinterable material using a second set of processing parameters. The processed first and second portions form, respectively, parts of a first and second structure of a multi-structured 3D object.

Printing a multi-structured 3D object

A method of making a semi-conducting microfiber. The method includes melting a semi-conducting solid polymer material to form a polymer melt, dipping a tip of a tool into the polymer melt, and lifting the tip of the tool away from the polymer melt, forming a microfiber. A semiconducting microfiber. The semiconducting microfiber contains a non-conjugated semiconducting polymer matrix containing crystalline aggregates with intentionally placed conjugation-break spacers along the polymer backbone. A device containing a plurality of semiconducting microfibers. Each of the semiconducting fibers contains a non-conjugated semiconducting polymer matrix containing crystalline aggregates with intentionally placed conjugation-break spacers along the polymer backbone. An apparatus to make a semiconducting microfiber. The apparatus contains a container to melt and hold the molten polymer, a tool dipped into the polymer melt, and a means of lifting tip of the tool away from a surface of the polymer melt forming a microfiber.

Semiconducting microfibers and methods of making the same

In some examples, at least one agent distributor may be to selectively deliver mixtures of coalescing agent and carrier onto portions of a layer of build material at variable coalescing agent concentrations and variable contone densities. A controller may be to control the at least one agent distributor to selectively deliver the mixture to a portion of the layer at a selected coalescing agent concentration and a selected contone density.

Coalescing agent concentrations and contone densities for three-dimensional objects

Examples include an apparatus for generating a three-dimensional object. The apparatus comprises at least one energy source, at least one build layer temperature sensor, and a controller. The controller is to control the at least one energy source to pre-fuse a portion of a build layer in a build area when a build layer temperature is less than a first temperature threshold. The controller is further to, after pre-fusing the portion of the build layer, control the at least one energy source to fuse the portion of the build layer in the build area when the build layer temperature is less than a second threshold.

Build layer temperature control

The present disclosure is drawn to material sets for 3D printing and methods of 3D printing. The material set can include a coalescent an organic-soluble near-infrared dye having a peak absorption wavelength from 800 nm to 1400 nm. The coalescent ink can also include water and an organic co-solvent. The material set can also include a particulate polymer formulated to coalesce when contacted by the coalescent ink and irradiated by a near-infrared energy having the peak absorption wavelength.

3-dimensional printing

The present disclosure is drawn to coalescent inks and material sets, such as for 3D printing. In one example, the coalescent ink can include a conjugated polymer, a colorant imparting a visible color to the coalescent ink, and an ink vehicle comprising a high boiling point co-solvent having a boiling point of 250&#xb0; C. or greater. The high boiling point co-solvent can be present in an amount from about 1 wt % to about 4 wt % with respect to the coalescent ink.

Coalescent ink

A three-dimensional (3D) object printing process-level simulator including, in an example, a layer module for modeling a plurality of layers of a simulated 3D object to be built and a printing device controller to receive a number of simulated values from the layer module to simulate a 3D object printing process and adjust the 3D object printing process based on physical characteristics of a printing device associated with the printing device controller. A cyber-physical three-dimensional (3D) object printing simulator including, in an example, a printing device including a processor to send instructions describing how a simulated 3D object is to be printed and a layers module to simulate heat transfer from a plurality of layers in the 3D object to be printed based at least a density of the plurality of layers.

Three-dimensional (3D) object printing simulator

Methods of making solid-state semiconducting films. The methods include forming a mixture by mixing at least two monomers in a pre-determined proportion such that at least one of the at least two monomers contains at least one non-conjugation spacer. Polymerization of the mixture is achieved by reacting the monomers with one another resulting in a solid state polymer which is then purified. The purified solid state polymer is dissolved in an organic solvent to form a homogenous solution which is then deposited onto a substrate, forming a solid-state semiconducting film by evaporating the solvent. Alternatively, the purified solid state polymer is deposited onto a substrate and heated to form a liquid melt, and cooling the liquid melt results in a solid state semiconducting thin film. Also, films comprising a semiconducting polymer composition containing a minimum of one non-conjugation spacer and devices comprising such films.

Methods and compositions for enhancing processability and charge transport of polymer semiconductors and devices made therefrom

In an example of a three-dimensional (3D) printing method, a polymeric or polymeric composite build material is applied. A fusing agent is selectively applied on at least a portion of the polymeric or polymeric composite build material. The fusing agent includes a discolorable near-infrared absorbing dye, a thiol surfactant, a reducing agent, and a balance of water. Near-infrared radiation is applied to the polymeric or polymeric composite build material at a condition that maintains a temperature of the selectively applied fusing agent below a decomposition temperature of the fusing agent and that allows the discolorable near-infrared absorbing dye to harvest near-infrared radiation energy, in order to fuse the portion of the polymeric or polymeric composite build material in contact with the fusing agent to form a layer and to initiate discoloration of the discolorable near-infrared absorbing dye in the layer.

Three-dimensional (3D) printing with discolorable near-infrared absorbing dye

Growing community of inventors

Palo Alto, CA, United States of America

Yan Zhao