Advanced Semiconductor Engineering, Inc.

Yan-Pin Huang

Kuan-Neng Chen

Kuo-Hua Chen

Tzu-Hua Lin

The disclosure relates to a semiconductor bonding structure and process and a semiconductor chip. The semiconductor bonding structure includes a first pillar, a first interface, an intermediate area, a second interface and a second pillar in sequence. The first pillar, the second pillar and the intermediate area include a first metal. The first interface and the second interface include the first metal and an oxide of a second metal. The content percentage of the first metal in the first interface and the second interface is less than that of the first metal in the intermediate area.

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Kaohsiung, Taiwan

Yan-Pin Huang