Entegris, Inc.

Yan Liu

Jakub Rybczynski

Steven Donnell

Chun Wang Chan

Carlo Waldfried

Chandra Venkatraman

Caleb Minsky

Yuxuan Liu

Pushkara Rao Varanasi

Richard A Cooke

Mark W Vose

Montray Leavy

Subhash Guddati

Thines Kumar Perumal

Zhifeng Li

Nate Richard

Scott Sirignano

Described are electrostatic chuck devices that are useful to support a workpiece while processing the workpiece, upper ceramic layer components of electrostatic chuck assemblies, the upper ceramic layer having a deposited dielectric layer, a relatively smooth finish, or both, and related methods.

Electrostatic chuck that includes upper ceramic layer that includes a dielectric layer, and related methods and structures

Described are electrostatic chucks that are useful to support a workpiece during a step of processing the workpiece, the electrostatic chuck including a pattern of charge dissipation lines on an insulating layer, the lines having a first conductive layer and a second conductive layer and being arranged to define enclosed fields of the insulating layer between the lines.

Electrostatic chuck with a charge dissipation structure

Described are electrostatic chucks that are useful to support a workpiece during a step of processing the workpiece, and electrostatic chuck base components prepared by an additive manufacturing technique.

Electrostatic chuck prepared by additive manufacturing, and related methods and structures

A conductive polymeric layer on an electrostatic chuck. The conductive polymeric layer comprises a conductive polymer and a photosensitive polymer. The conductivity of the conductive polymer promotes charge dissipation by the conductive polymeric layer, while the photosensitivity of the photosensitive polymer allows the surface of the conductive polymeric layer to be photopatterned. The extent to which the conductive polymeric layer is conductive and photosensitive may be modulated by varying the relative amounts of the conductive polymer and the photosensitive polymer.

Conductive polymeric layers for charge dissipation

Described are electrostatic chucks designed for use in supporting a workpiece during a workpiece processing step, the electrostatic chuck including a gas flow system.

Electrostatic chuck having a gas flow feature, and related methods

Described are techniques for applying a cured polymeric blanket coating onto a surface, specifically for applying a blanket-coated cured polymeric coating onto a surface of a substrate that is useful as an electrostatic chuck for processing semiconductor wafers.

Methods for applying a blanket polymer coating to a substrate

An electrostatic chuck solves the problem of wafer sticking by providing conductive paths on raised embossments that are bridged together and are connected to ground that support the wafer substrate above the surface of the electrostatic chuck. Further, laterally spaced electrode patterns and electrode elements which are spaced laterally and longitudinally away from the raised embossments reduce or eliminate electrical coupling during wafer clamping between conductively coated embossments and the electrode elements, thereby creating a low resistance path for charges remaining on the wafer after declamping to promptly travel to ground. The conductive bridge and electrode pattern configuration also substantially reduces or eliminates any charge build up on the conductive bridge(s) during clamping in order that charge build up in 'islands' (worn portions of the insulator layer of the main field area) do not affect the charge dissipation from the wafer substrate through the conductive bridges to ground.

Electrostatic chuck with charge dissipation coating

Described are electrostatic chucks that are useful to support a workpiece during a step of processing the workpiece, the electrostatic chuck including embossments that are made of multiple deposited layers, the layers including diamond-like carbon layers and layers that contain silicon-based materials such as silicon carbide layers.

Electrostatic chuck with embossments that comprise diamond-like carbon and deposited silicon-based material, and related methods

Electrostatic chucks include multiple electrodes, each having a spiral shape surrounding a center of a surface of the electrostatic chuck, to provide a polyphase electrostatic chuck. Each electrode can be connected to a different phase of power. The spiral shapes can each avoid one another as well as avoiding holes or openings in the surface of the electrostatic chuck. The spiral shapes can be algorithmically determined using a processor. These electrostatic chucks can include three or more electrodes. Methods of manufacture of the electrostatic chucks include determining shapes for each of the electrodes and providing each of the electrodes.

Spiraling polyphase electrodes for electrostatic chuck

Described are multi-layer electrostatic chucks used to secure and support a wafer substrate during wafer processing, and related methods, wherein the chuck includes a grounding structure that includes a grounding layer and a grounding pin.

Grounding mechanism for multi-layer for electrostatic chuck, and related methods

In accordance with an embodiment of the invention, there is provided an electrostatic chuck. The electrostatic chuck comprises a surface layer activated by a voltage in an electrode to form an electric charge to electrostatically clamp a substrate to the electrostatic chuck. The surface layer includes a plurality of polymer protrusions and a charge control layer to which the plurality of polymer protrusions adhere, the plurality of polymer protrusions extending to a height above portions of the charge control layer surrounding the plurality of polymer protrusions to support the substrate upon the plurality of polymer protrusions during electrostatic clamping of the substrate.

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Lexington, MA, United States of America

Yan Liu