Sae Magnetics (h.k.) Limited

Yan Bin Wang

Chi Hung Yuen

Shen Kuang Sidney Chou

Lu Xiao

Li Ping Peng

Bin Zhao

Shu Ming Zhang

Ming Liang Lin

A slider includes a substrate having a trailing edge, a leading edge opposite the trailing edge, and an air bearing surface connecting the trailing edge with the leading edge; a read/write transducer formed at the trailing edge; and a coat layer attached on the trailing edge and covering on the read/write transducer. The slider further includes a protection layer for shielding the read/write transducer thereby preventing the read/write transducer from damaging during a laser soldering process. The present invention can prevent the read/write transducer from damaging during the laser bonding process and, in turn improve the reading and writing performance of the slider. The invention also discloses an HGA and a disk drive unit.

Slider including laser protection layer, head gimbal assembly, and disk drive unit with the same

A magnetic head includes a slider substrate having a trailing edge and multiple bonding pads arranged on the trailing edge in a row. Each of the bonding pads includes a seed layer adhered to the trailing edge and electrically connected with the slider substrate, a soldering layer formed on the seed layer and adapted for connecting with a suspension, and at least one solder nonwettable layer adhered to the trailing edge and connected with at least one side of the seed layer. The structure of the magnetic head is simple and stable, which can prevent the bonding pads bridging and shorting-circuit. An HGA and a disk drive unit with the same, a manufacturing method for the magnetic head are also disclosed.

Magnetic head, head gimbal assembly and disk drive unit with the same, and manufacturing method thereof

A suspension includes a flexure and a plurality of electrical traces formed on the flexure. Each electrical trace has a trace body and a bonding pad arranged for connecting with a slider, and the bonding pad is a free end before connecting with the slider and is capable of bending to the trace body flexibly, and the bonding pad includes a trace body layer and a solder layer formed on the trace body layer, thereby the bonding pads of the electrical traces connecting with the slider by reflowing the solder layer. The present invention uses no extra solder balls, so as to reduce the manufacturing cost and the corresponding apparatus cost. The invention also discloses a manufacturing method of a suspension, and a connecting method for a suspension and a slider.

Suspension having bonding pads with solder layers, manufacturing method of a suspension, and connecting method between a suspension and a slider

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Dongguan, China

Yan Bin Wang