Mitsubishi Denki Kabushiki Kaisha

Yamamoto Shigeyuki

Hiroshi Adachi

A solution containing a low-temperature curing type organosilicon ladder resin composition comprising: (A) a polylphenysylsesquioxane which has a hydroxyl group at the end, in which 3% of the side chain consists of vinyl groups, and which has a weight-average molecular weight of 150,000; (B) 1.8 wt % of 3,3'-diazidophenylsulfone based on the polylphenysylsesquioxane (A); and (C) methoxybenzene which is added to the polylphenysylsesquioxane (A) so that the polylphenysylsesquioxane content is about 15 wt % is used as the material for a surface protective film of a color filter for a light-receiving element or a display element.

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Amagasaki, Japan

Yamamoto Shigeyuki