Tower Semiconductor Ltd.

Ramot at Tel-aviv University Ltd.

Newport Fab, LLC

Yissum Research Development Company of the Hebrew University of Jerusalem Ltd.

Tower Partners Semiconductor Co., Ltd.

Hillberry Gat Ltd.

Redcat Devices Srl

Yakov Roizin

Evgeny Pikhay

Amos Fenigstein

Avi Strum

Alexey Heiman

Micha Gutman

Menachem Vofsy

Efraim Aloni

Vladislav Dayan

Ruth Shima-Edelstein

Assaf Lahav

Pikhay Evgeny

David J Howard

Yossi Rosenwaks

Ira Naot

Alex Sirkis

Klimentiy Shimanovich

Victor Kairys

Avi Ben-Gigi

Michael Lisiansky

Yhonatan Vaknin

Simon Litsyn

Erez Sarig

Gil Rosenman

Itzhak Edrei

Rassul Karabalin

Anatoly Sergienko

Zohar Shaked

Micha Asscher

Zohar Kuritsky

Liz Poliak

Michael Yampolsky

Irit Chen-Zamero

Ora Eli

Amir Saar

Ido Gilad

Doron Pardess

Ronen Shaul

Ishai Naveh

Myriam Buchbinder

Roy Strul

Koji Yoshida

Hiroshige Hirano

Paul D Hurwitz

Masatoshi Arai

Fumihiko Noro

Nobuyoshi Takahashi

Cristiano Calligaro

Masahiko Sakagami

Hiroaki Kuriyama

Yossi Netzer

Allon Parag

Alexei Heiman

Viktor Goldovsky

David Avner

Zmira Shterenfeld-Lavie

Amir Handelman

Avi Ben-Guigui

Adi Birman

Daniel Nehmad

David Zfira

Yohanan Davidovich

Asaf Lahav

Shimon Greenberg

Alfred Yankelevich

Christopher Cork

Hironori Matsuyoshi

Carmel Sahar

Toshiaki Ohmi

Igor Aisenberg

Abed Qaddah

Mikalai Audzeyeu

Yuriy Makarevich

Bouhnik Yami

Siarhei Shvedau

Nagar Magi

Anatoly Belous

Barhum Liat

A method for manufacturing an optical system, the method includes obtaining an intermediate semiconductor item that comprises a silicon substrate and a stack of layers that comprises a monocrystalline silicon layer and is positioned between two silicon alloy layers; wherein the silicon substrate comprises diffusion regions; and performing Complementary Metal-Oxide-Semiconductor (CMOS) compliant operations to provide, based on the intermediate semiconductor item, a first switching cell that is formed on the silicon substrate.

Method for manufacturing an optical switching system

An optical switching system, including a silicon substrate; a first switching cell that is formed on the silicon substrate, wherein the first switching cell includes first till thirs ports, a monocrystalline silicon waveguide (MSW) that comprises a first MSW segment and a second MSW segment; and an actuation unit that is configured to move each one of the first MSW segment and the second MSW segment between at least three different positions thereby determining whether an optical signal received at the first port is (a) directed through the MSW to the second port, or (b) is directed to the third port through a first bus waveguide.

Optical switching system

A UVC disinfection system that may include a UVC radiation illumination unit, a control unit, and a node. The node may include (i) a power supply, (ii) a UVC dose sensing unit that comprises a UVC sensing element, wherein the UVC dose sensing unit is configured to sense that the UVC radiation dose received by the node reached a predefined UVC radiation dose; and (iii) a node transmitter that is configured transmit a node unique signal following a sensing, by the UVC dose sensing unit, that the UVC radiation dose received by the node reached a predefined UVC radiation dose. The control unit is configured to control an emission of UVC radiation from the UVC radiation illumination unit based on a reception or a lack of reception of the node unique signal.

Ultraviolet C (UVC) detection

A semiconductor device includes a storage element write unit including a storage element configured to be electrically written only once and store two values, a write controller connected to the storage element through a first node signal and configured to perform a write to the storage element based on a write control signal instructing a write to the storage element, and a write state detection circuit configured to detect that the storage element is in a write state based on a measurement signal obtained by measuring the first node signal. In a case where the write controller receives a detection signal indicating that the storage element is in the write state from the write state detection circuit after start of a write to the storage element, the write controller stops write operation after a lapse of a predetermined time from detection of the write state of the storage element.

Semiconductor device for writing to a storage element

A method fabricating a GaN based sensor including: forming a gate dielectric layer over a GaN hetero-structure including a GaN layer formed over a substrate and a first barrier layer formed over the GaN layer; forming a first mask over the gate dielectric layer; etching the gate dielectric layer and the first barrier layer through the first mask, thereby forming source and drain contact openings; removing the first mask; forming a metal layer over the gate dielectric layer, wherein the metal layer extends into the source and drain contact openings; forming a second mask over the metal layer; etching the metal layer, the gate dielectric layer and the GaN heterostructure through the second mask, wherein a region of the GaN heterostructure is exposed; and thermally activating the metal layer in the source and drain contact openings. The gate dielectric may exhibit a sloped profile, and dielectric spacers may be formed.

Method of forming a GaN sensor having a controlled and stable threshold voltage in the sensing area

A UV radiation sensor that includes an area that is filled with a dielectric material, the area comprises a first portion of a first thickness and a second trench portion with dielectric of a second thickness, wherein the first thickness is smaller than the second thickness; a floating gate that comprises a first floating gate portion that is positioned above the first area portion and a second floating gate portion that is positioned above the trench portion, wherein the second floating gate portion comprises multiple segments, wherein there are one or more gaps between two or more of the multiple segments; a charging element for charging the floating gate; and a readout element for reading the floating gate.

Ultraviolet radiation sensor

A method for radiation dosage measurement includes: (1) exposing a plurality of single-poly floating gate sensor cells to radiation; (2) measuring threshold voltage differences between logical pairs of the exposed sensor cells using differential read operations, wherein the sensor cells of each logical pair are separated by a distance large enough that radiation impinging on one of the sensor cells does not influence the other sensor cell; (3) determining whether each logical pair of exposed sensor cells is influenced by exposure to the radiation in response to the corresponding measured threshold voltage difference; and (4) determining a dosage of the radiation in response to the number of logical pairs of the exposed sensor cells determined to be influenced by exposure to the radiation. A non-radiation influenced threshold voltage shift may be measured and used in determining whether each logical pair of exposed sensor cells is influenced by radiation exposure.

High resolution radiation sensor based on single polysilicon floating gate array

An ultraviolet sensor that may include a group of serially connected photovoltaic diodes of alternating polarities; a selective blocking portion that is configured to prevent ultraviolet radiation from reaching photovoltaic diodes that belong to the group and are of a first polarity, while allowing the ultraviolet radiation to reach photovoltaic diodes that belong to the group and are of a second polarity; and an interface for providing an output signal of the group, the output signal is indicative of ultraviolet radiation sensed by the photovoltaic diodes that belong to the group and are of the second polarity.

Ultraviolet sensor and a method for sensing ultraviolet radiation

An electrostatically controlled sensor includes a GaN/AlGaN heterostructure having a 2DEG channel in the GaN layer. Source and drain contacts are electrically coupled to the 2DEG channel through the AlGaN layer. A gate dielectric is formed over the AlGaN layer, and gate electrodes are formed over the gate dielectric, wherein each gate electrode extends substantially entirely between the source and drain contacts, wherein the gate electrodes are separated by one or more gaps (which also extend substantially entirely between the source and drain contacts). Each of the one or more gaps defines a corresponding sensing area between the gate electrodes for receiving an external influence. A bias voltage is applied to the gate electrodes, such that regions of the 2DEG channel below the gate electrodes are completely depleted, and regions of the 2DEG channel below the one or more gaps in the direction from source to drain are partially depleted.

Electrostatically controlled gallium nitride based sensor and method of operating same

For example, an Electrostatically Formed Nanowire (EFN) may include a source region; at least one drain region; a wire region configured to drive a current between the source and drain regions via a conductive channel; a first lateral-gate area extending along a first surface of the wire region between the source and drain regions; a second lateral-gate area extending along a second surface of the wire region between the source and drain regions; and a sensing area in opening in a backside of a silicon substrate under the wire region and the first and second lateral-gate areas, the sensing area configured to, in reaction to a predefined substance, cause a change in a conductivity of the conductive channel.

Apparatus, system and method of an electrostatically formed nanowire (EFN)

A radiation sensor that may include a first transistor, a first isolated conductive structure that comprises a floating gate of the first transistor, a first group of radiation sensing diodes that are coupled to each other, wherein the first group is configured to convert sensed radiation that is sensed by the first group to a first output signal, and to change a state of the first isolated conductive structure using the first output signal, a second transistor, a second isolated conductive structure that comprises a floating gate of the second transistor, and a second group of radiation sensing diodes that are coupled to each other, wherein the second group is configured to convert sensed radiation that is sensed by the second group to a second output signal, and to change a state, under a control of the first transistor, of the second isolated conductive structure using the second output signal.

Radiation sensor

Method of forming a GaN sensor having a controlled and stable threshold voltage

A UV sensor includes a GaN stack including a low-resistance GaN layer formed over a nucleation layer, and a high-resistance GaN layer formed over the low-resistance GaN layer, wherein a 2DEG conductive channel exists at the upper surface of the high-resistance GaN layer. An AlGaN layer is formed over the upper surface of the high-resistance GaN layer. A source contact and a drain contact extend through the AlGaN layer and contact the upper surface of the high-resistance GaN layer (and are thereby electrically coupled to the 2DEG channel). A drain depletion region extends entirely from the upper surface of the high-resistance GaN layer to the low-resistance GaN layer under the drain contact. An electrical current between the source and drain contacts is a function of UV light received by the GaN stack. An electrode is connected to the low-resistance GaN layer to allow for electrical refresh of the UV sensor.

Gallium nitride based ultra-violet sensor with intrinsic amplification and method of operating same

A method for manufacturing a semiconductor device, the method may include forming a first part of a hollow in first part of a first layer of the semiconductor device and coating a sidewall of the first part of the hollow with an etch stop material, wherein the forming of the first part of the hollow comprises performing at least one iteration of (i) anisotropic etching and (ii) deposition of the etch stop material; wherein when completed, the semiconductor device comprises a radio frequency (RF) circuit; forming a second part of the hollow in a second part of the first layer by performing isotropic etching that involves directing plasma through the first part of the hollow; wherein the second part of the hollow reaches either (a) a bottom of a second layer of the semiconductor device or (b) the RF circuit; and wherein at least a majority of the second part of the hollow is wider than at least a majority of the first part of the hollow.

Semiconductor device having a radio frequency circuit and a method for manufacturing the semiconductor device

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Yakov Roizin