Accretech Usa, Inc.

Yakov Keyfes

Vladimir Volovich

Edmond Arzumau Abrahamians

William Jefferson Stone, Iii

Igor Kravtsov

Herbert Wayne Owens, Jr

An apparatus and method is provided for polishing work pieces such as semiconductor wafers. The apparatus includes a variable number of independent heads, platensand polishing units. This polishing apparatus belongs to a group of polishing machines with wafers attached to the same headsthrough all polishing steps without undesirable reloading from one headto another between polishing steps. Each independent headis automatically coupled to and decoupled from any of the polishing unitsto optimize throughput and provide flexibility in accommodating different polishing processes. A head transfer subsystemprovides an independent means of transfer for each head, thus an infinite number of contemporaneous or overlapping polishing cycles can be completed on multiple wafers resulting in maximum processing throughput.

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San Francisco, CA, United States of America

Yakov Keyfes