Applied Materials, Inc.

Orbot Instruments Ltd.

Applied Materials Israel Limited

Yair Eran

Meir Aloni

Yigal Katzir

Amir Alon

Emanuel Elyasaf

Itzhak Katz

Gideon Rosenfeld

Gad Greenberg

Ehud Tirosh

Boaz Kenan

Avner Karpol

Ami Sade

Shirley Hemar

Haim Kaplan

Joel Yolles

Ariel Ben-Porath

Youval Nehmadi

Yaron Cohen

Zamir Abraham

Amnon Joseph

Gil Sod-Moriah

Chen Ofek

The invention provides a method that includes the stages of: (i) receiving design information representative of a portion of an object that includes sub micron measurement targets, (ii) processing the received design information to provide a large number of measurement targets; and (iii) associating target measurement parameters to each of large number of measurement targets. The invention provides a system that includes: (i) an interface for receiving design information representative of a portion of a layer of an object that includes sub micron measurement targets; and (ii) a processor, coupled to the interface, for processing the received design information to provide a large number of measurement targets; and for associating target measurement parameters to each of large number of measurement targets.

Process monitoring system and method for processing a large number of sub-micron measurement targets

A method and apparatus for inspecting a reticle measures line widths using an inspection tool that images the reticle and compares the image with a design database to detect errors in real time. The differences between the line widths of patterns on the reticle and the design database are stored during the inspection procedure. The difference (or 'bias') information is then processed off-line to create a map of all the local line-width deviation values (i.e., bias) of every feature on the reticle. The resultant local bias map can be used as a feedback mechanism to improve the reticle manufacturing process, as a 'go/no go' criteria for the validity of the reticle, and as a standard report shipped together with the mask to the wafer fabrication facility, where it can be used as a yield-enhancing tool.

Local bias map using line width measurements

A reticle inspection system for inspecting reticles can be used as an incoming inspection tool, and as a periodic and pre-exposure inspection tool. Mask shops can use it as an inspection tool compatible to their customers, and as a printable error detection tool. The inventive system detects two kinds of defects: (1) line width errors in the printed image; (2) surface defects. The line width errors are detected on the die area. The detection is performed by acquiring the image of the reticle under the same optical conditions as the exposure conditions, (i.e. wavelength, numerical aperture, sigma, and illumination aperture type) and by comparing multiple dies to find errors in the line width. Surface defects are detected all over the reticle. The detection of surface defects is performed by acquiring transmission and dark-field reflection images of the reticle and using the combined information to detect particles, and other surface defects.

Method and apparatus for reticle inspection using aerial imaging

A defect detection system for inspecting objects such as reticles, photomasks, semiconductor wafers, flat panel displays and other patterned objects has two or more stages, whereby the object is examined separately for fine defects, by inspecting a binary level representation of the object, and for ultra fine defects, by inspecting a gray level representation of the object. The system also includes re-inspection apparatus for re-inspection of detected defects, thereby to reduce the false alarm rate, and for classifying the remaining defects by size, area and type.

Apparatus and method for microscopic inspection of articles

Method for reticle inspection using aerial imaging

In a system for real-time inspection of patterns formed on a base, the pattern including surfaces and edges. The system provides for a detector that includes: (i) two input channels for receiving streams of pixels representing the patterns. Each pixel representing the surface and/or edge of the pattern in sub-pixel boundary, (ii) two line width measurement devices being responsive to the streams of pixels for processing in real time the pixels in a manner that corresponds to a predetermined direction in the patterns, so as to measure, in sub-pixel boundary, line width data between two edges. This measurement is effected by executing the following steps: (i) detecting an opening edge, (ii) successively updating line width; and (iii) providing a line width measurement in response to detecting a closing edge. The detector further includes comparator being responsive to the line width data delivered from the two line width measurement devices, for comparing the line width data and obtaining difference between them, so as to generate a defect.backslash.no defect indication depending upon the difference.

Dimension error detection in object

A method for comparing first and second digital representations of an image, the method comprising the steps of: for each individual translation from among a plurality of translations from the first digital representation to the second digital representation: for each individual image location from among a plurality of image locations within a comparison entity within the first digital representation, determining a binary legitimacy value of the individual translation for the individual image location by comparing the individual image location to a location in the second digital representation defined by operating the individual translation on the individual image location; and combining the binary legitimacy values of image locations within the comparison entity, thereby to generate a comparison entity legitimacy value determining whether the individual translation is legitimate for the comparison entity; and announcing a defect for the comparison entity if none of the plurality of translations are legitimate therefor.

Apparatus and method for comparing and aligning two digital

This invention discloses an apparatus for optically inspecting an object having upper and lower faces for indicating the condition of the object, including a lighting system periodically reflecting a beam of light from one face of the object to produce a series of short-duration time-spaced reflected beams, and periodically transmitting a beam of light through both faces of the object to produce a series of short-duration time-spaced transmitted beams time-interlaced with the reflected beams, a sensor sensing the short-duration time-spaced reflected beams and transmitted beams, and generating electrical outputs corresponding thereto, and a processor receiving the electrical outputs and processing them to provide an indication of the condition of the object. A method of optically inspecting an object having upper and lower faces for indicating the condition of the object is also described.

Optical inspection method and apparatus

An inspection method including the steps of providing a patterned object to be inspected and compared with a reference, inspecting the patterned object and providing an output of information relating to the visual characteristics of the patterned object, comparing binary level information relating to the visual characteristics of the patterned object to binary level information relating to the visual characteristics of the reference, and comparing gray level information relating to the visual characteristics of the patterned object to gray level information relating to the visual characteristics of the reference.

Apparatus and method for inspection of a patterned object by comparison

The present invention seeks to provide an improved system for inspection of and detection of defects in objects such as reticles, photomasks, semiconductor wafers, flat panel displays and other patterned objects. Preferably, the system has two or more stages, whereby the object is examined separately for fine defects, preferably by inspecting a binary level representation of the object, and for ultra fine defects, preferably by inspecting a gray level representation of the object. The system also preferably includes reinspection apparatus for reinspection of detected defects, thereby to reduce the false alarm rate, and for classifying the remaining defects by size, area and type.

Growing community of inventors

Rehovot, Israel

Yair Eran