Gao Gesellschaft Fur Automation Und Organisation Mbh

Giesecke & Devrient Gmbh

Yahya Haghiri-Tehrani

Joachim Hoppe

Arno Hohmann

Wolfgang Gauch

Renee-Lucia Barak

Ando Welling

Eugen Neumann

Thomas Tarantino

Albert Ojster

Helmut Baader

Matthias Bergmann

Werner Obrecht

Achim Oertel

Gustav Dax

Josef Strassmaier

A circuit unit having a circuit unit comprising an insulating substrate () on which a conductive, flat coil () is located. The coil () can consist of a plurality of coil layers () separated by insulating layers (). To inter-connect the individual coil layer section () into a coil, at least one opening () is provided in each of the insulating layers (). The connection between the first coil ends () of the coil () and an integrated circuit () or a module () containing the integrated circuit () can be formed solely by the coil ends () and the connection points () of the integrated circuit () or the contacts () of the module () touching. The individual turns of the coil () can be disposed and dimensioned so as to permit embossing of the circuit unit without restriction within an area () conforming with the standard.

Method for producing a circuit unit

The invention relates to different methods for distortion-free production of data carriers having at least in partial areas a transparent plastic layer with a surface structure in the form of a lens structure. The surface structure can be produced by cutting method or embossed by applying heat and pressure. Alternatively the surface structure can be produced as a separate element which is connected after its production with the data carrier.

Data carrier

The invention relates to a card-shaped data carrier comprising a card body ( ) having an antenna ( ), and a chip module ( ) containing an integrated circuit ( ) and inserted into a gap ( ) in the card body ( ). The electric connection between the antenna ( ) and the chip module ( ) is effected via depressions ( ) in the terminals ( ) of the antenna ( ). For producing the inventive data carrier one provides the card body ( ), in which the antenna ( ) is at least partly embedded, with a gap ( ). The terminals ( ) of the antenna ( ) are exposed by removing the superjacent card material whereby part of the material forming the terminals ( ) is also removed. The chip module ( ) is inserted into the gap ( ) and for example glued to the card body ( ) with a thermally activable adhesive ( ), an electric connection being formed between the chip module ( ) and the antenna ( ) for example by means of a conductive adhesive ( ) previously applied to the exposed terminals ( ) of the antenna ( ). In the preferred embodiment the material removal on the terminals ( ) of the antenna ( ) is effected such that a bevel arises.

Modular data medium

A circuit unit having an insulating substrate (1) on which a conductive, flat coil (3) is located. The coil (3) can consist of a plurality of coil layer sections (9, 17) separated by insulating layers (11). To interconnect the individual coil layer sections (9, 17) into a coil, at least one opening (13) is provided in each of the insulating layers (11). The connection between the first coil ends (15, 19) of the coil (3) and an integrated circuit (7) or a module (23) containing the integrated circuit (7) can be formed solely by the coil ends (15, 19) and the connection points (27) of the integrated circuit (7) or the contacts (25) of the module (23) touching. The individual turns of the coil (3) can be disposed and dimensioned so as to permit embossing of the circuit unit without restriction within an area (37, 38) conforming with the standard.

Circuit unit and a method for producing a circuit unit

An electronic module for data carriers having at least one integrated circuit includes an electrically conductive layer with contact surfaces for communication of the circuit with external devices and having an insulated layer which is connected to the conductive layer and has recesses for electrically connecting the contact surfaces with the circuit. Each recess protrudes partly into the contact surface adjacent the recess. The recesses may be formed in such a way that the area of insulating layer remaining in the center of the module takes up substantially only the integrated circuit surface.

Electronic module for data cards

Data medium incorporating integrated circuits

A data carrier in which an electronic module comprising an integrated circuit and a coil electrically connected with the circuit is disposed in a channel in the data carrier. To permit simple manufacture of the data carrier, at least one opening for forming the channel is provided in at least one card layer, the opening being formed such that the layer is a cohesive layer.

Data carrier with electronic module and embedded coil feature

A method for making integrated circuits electrically connected to conductive coil elements includes placing integrated circuits in recesses provided at precise locations along a foil carrier web and positioning coils also at designated locations on the foil web so that a coil is associated with each integrated circuit. The web is then cut to produce a planar coil electrically connected to an integrated circuit on a foil element. The integrated circuit and coils may be coated with a casting compound and the coils may be formed using various procedures, including pressing coils into the surface of the foil, sewing the coils to the foil and electrostatically forming the coils on the foil with fusion of the coil material directly onto the foil. Apparatus for carrying out the aforesaid process, including winding of the coils, is described.

Method for producing integrated circuits and coils on carrier webs

The invention relates to a data carrier comprising a card body and an integrated circuit connected electroconductively via contact elements with at least one coil serving the purpose of power supply and/or data exchange of the integrated circuit with external devices. The invention is characterized in that the integrated circuit and the contact elements form a separate module known in the art and the coil is disposed on a card body constructed from one or more layers in known fashion. The coil is preferably formed as a flat coil.

Data carrier having separately provided integrated circuit and induction

In a multilayer data carrier, an electronic module is provided in a corresponding opening or gap in at least one layer. For filling the remaining cavity after installation of the module in the gap, one provides on a layer adjacent the gap or on the layer containing the gap or directly on the electronic module a material preferably applied by printing technology and having a softening point lower than the softening point of the layer.

Method for producing a data carrier

A lead frame module to be incorporated in data carriers is presented which is divided into two areas, namely a central area receiving the sensitive components of the module, and an outer area protruding beyond the edge of the central area and serving to glue the lead frame module to the data carrier. To prevent forces from being transmitted from the outer area of the electronic module to the central area upon bending loads of the data carrier, the outer area is decoupled mechanically from the central area. This can be done for example by providing partial discontinuities including relieving punchings in the transition between the central and outer area.

Electronic module and a data carrier having an electronic module

A method of making an electronic module with an integrated circuit includes beginning with a standardized starting product in the form of an insulating substance bearing a conductive coating. Contact surfaces are formed in the conductive coating by interruptions in the insulating substance. Using milling cutter one provides the insulating layer of the starting product with variable patterns of recesses through which conductive connections between the contact surfaces and the integrated circuit are later guided. The position of the recesses is varied in accordance with the size of the integrated circuit to be incorporated in the electronic module.

Method and apparatus for making an electronic module for cards

The invention relates to a method for producing data carriers containing a positioned element on at least one of their surfaces from a multiple-copy sheet. As many method steps as possible are performed on the multiple-copy sheet which is subdivided, before the elements are positioned in the data carriers, into smaller units having positioning markings as position references. Using these markings the small units are brought in an exact position relative to various working stations, where several data carriers in the units are provided with a positioned element simultaneously.

Method for producing data carriers

Method and apparatus for producing a plastic molded chip card having

On a check card having a mini chip card disposed detachably in an adapted recess the mini chip card is fixed in position by at least one fastening element provided on the card surface. After a first punching operation in which the mini chip card is still connected with the card body by bridges the fastening element is preferably placed on the card in such a way that it bridges the areas between the mini chip card and the card body. In a second punching operation the bridges are removed, after which the mini chip card is held in its original position on the card body only by the fastening element.

Growing community of inventors

Munich, Germany

Yahya Haghiri-Tehrani