Proteantecs Ltd.

Yahel David

Eyal Fayneh

Evelyn Landman

Shai Cohen

Inbar Weintrob

Yair Talker

Guy Redler

Edi Shmueli

Faten Tanasra

Alexander Burlak

Failure risk measurement in a semiconductor Integrated Circuit (IC) by generating a pulse of a preset time duration on an output path when a signal from a data path and/or control logic circuit of the semiconductor IC changes. The data paths and/or control logic circuits of the semiconductor IC have a common clock. The output paths may be combined to provide a combined output path and a signal on the combined output path may be delayed by a configurable time duration, providing a delayed combined output path signal thereby. The delayed combined output path signal may be received at a data input of a device state element, which is clocked by a signal based on the common clock and outputs a failure risk measurement signal.

Integrated circuit margin measurement

A computerized method for IC classification, outlier detection and/or anomaly detection comprising using at least one hardware processor for testing each of the plurality of ICs in accordance with an IC design on a wafer, wherein the IC design comprises a plurality of sensors. The at least one hardware processor is used for testing each of the plurality of ICs by: collecting a plurality of sensor values, the plurality of sensor values including sensor values from each of the plurality of sensors; comparing the plurality of sensor values to a classification scheme, thereby obtaining a classification for each tested IC; and recording the classification of the tested IC.

Integrated circuit profiling and anomaly detection

A semiconductor integrated circuit (IC) comprising a time-to-digital converter (TDC) configured to measure an input-to-output delay of an I/O buffer of a pad the IC, the measured delay reflecting a connection impedance of the pad. A circuit in the IC, or a computer in communication with the IC, determines electrical connection integrity of the pad based on the measured delay of the I/O buffer.

Integrated circuit pad failure detection

A method comprising using at least one hardware processor for: running a Monte Carlo simulation of possible integrated circuit (IC) process variations of each of a plurality of IC cell types, wherein each of the plurality of IC cell types is defined by multiple specific transistors and multiple specific interconnects; based on the results of the Monte Carlo simulation, creating a library of IC cell types and their corresponding behavioral values for each of the possible IC process variations, and storing the library in a non-transient memory; receiving an IC design embodied as a digital file; correlating the received IC design with the library; and predicting a frequency distribution and a power distribution of ICs manufactured according to the IC design.

Efficient integrated circuit simulation and testing

An integrated circuit (IC) comprising: a margin measurement circuit configured to monitor multiple data paths of the IC and to output, at different times, different ranges of remaining margins of the multiple data paths; a workload sensor configured to output a value representing aggregate operational stress experienced by the IC over a period of time ending at each of the different times; and a processor configured to: (i) compute, based on the value output by said workload sensor, an upper bound and a lower bound of change of the remaining margin of the IC, and (ii) compute upper and lower bounds of a current remaining margin of the IC, based on (a) the upper and lower bounds of change, and (b) a remaining margin indicated by a border between two adjacent ranges outputted by the margin measurement circuit.

Integrated circuit workload, temperature, and/or sub-threshold leakage sensor

A semiconductor integrated circuit (IC) comprising a signal path combiner, comprising a plurality of input paths and an output path. The IC comprises a delay circuit having an input electrically connected to the output path, the delay circuit delaying an input signal by a variable delay time to output a delayed signal path. The IC may comprise a first storage circuit electrically connected to the output path and a second storage circuit electrically connected to the delayed signal path. The IC comprises a comparison circuit that compares outputs of the signal path combiner and the delayed signal, wherein the comparison circuit comprises a comparison output provided in a comparison data signal to at least one mitigation circuit.

Integrated circuit margin measurement and failure prediction device

Integrated circuit degradation estimation and time-of-failure prediction using workload and margin sensing

Determination of one or more operating conditions (leakage current, temperature and/or workload) of a functional transistor in a semiconductor integrated circuit (IC). The functional transistor provides an electrical current, which is provided as an input to a ring oscillator (ROSC). The ROSC is located in the IC proximate to the functional transistor and has an oscillation frequency in operation. The one or more operating conditions of the functional transistor are determined based on the oscillation frequency of the ROSC.

Integrated circuit workload, temperature and/or subthreshold leakage sensor

A semiconductor integrated circuit (IC) comprising a time-to-digital converter circuit (TDC), wherein time inputs to the TDC are (i) one or more input to an input/output (I/O) buffer of a pad of the IC, and (ii) one or more output from the I/O buffer. The IC comprises a digital comparator circuit electrically configured to: receive a stream of digital output values from the TDC, compare each value of the stream to one or more previous value in the stream, and when the comparison reflects a difference value greater than a threshold, issuing a notification to a user of the IC.

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Kibbutz Gazit, Israel

Yahel David