Nxp Usa, Inc.

Yadong Wei

Leo M Higgins, Iii

Burton Jesse Carpenter

Jinzhong Yao

Fred T Brauchler

Xingshou Pang

Mariano Layson Ching, Jr

Jinmei Liu

Jianhong Wang

A packaged integrated circuit (IC) device includes a first IC die with a first inductor, a first layer of adhesive on a first major surface of the first IC die, an isolation layer over the first layer of adhesive, a second layer of adhesive on the isolation layer, a second IC die on the second layer of adhesive, and a second inductor in the second IC die aligned to communicate with the first inductor. The isolation layer extends a prespecified distance beyond a first edge of the second IC die.

Packaged integrated circuit having stacked die and method for therefor

Growing community of inventors

Tianijn, China

Yadong Wei