Mellanox Technologies, Ltd.

Ramot at Tel-aviv University Ltd.

Bar-ilan University

Simtal Nano-coatings Ltd

Security Matters Ltd.

Yaakov Gridish

Elad Mentovich

Sylvie Rockman

Itshak Kalifa

Dimitrios Kalavrouziotis

Hanan Shumacher

Eyal Moshe Waldman

Anna Sandomirsky

Eitan Zahavi

Benny Koren

Evelyn Landman

Alon Webman

Oded Wertheim

Juan Jose Vegas Olmos

Doron Naveh

Matan Galanty

Tali Septon

Yaniv Rotem

Yosi Ben-naim

Vadim Balakhovski

Chen Stern

Tal Kaufman

Ariel Ismach

Eran Bar-rabi

Paraskevas Bakopoulos

Andrey Ger

Boaz Atias

Siddha Ganju

Nadav Yoran

Haggai Alon

Tamir Sharkaz

Tzemah Kislev

Mor Kaplinsky

Pierre Avner Badehi

Eran Aharon

Yoram Zer

Avital Trachtman

Lion Bassat

Amir Prescher

Itamar Frenkel

Rotem Barzilai

Anders Gösta Larsson

Nimrod Rockman

Alon Rubinstein

Eyal Waldman

A first and a second flange assembly configured for facilitating uniform and laminar flow in a system are provided. The first flange assembly includes a first flange body configured to introduce a gas into a chamber. The first flange assembly includes a plurality of outlet tubes disposed on an interior surface of the first flange body and a plurality of inlet tubes disposed on an exterior surface of the first flange body and in fluid communication with the plurality of outlet tubes. The second flange assembly includes a second flange body configured to remove the gas from the chamber. The second flange assembly includes a plurality of through holes extending from an interior surface to an exterior surface of the second flange body and a plurality of exit tubes extending from the exterior surface of the second flange body and in fluid communication with the plurality of through holes.

CVD system with flange assembly for facilitating uniform and laminar flow

A method and system for analyzing Vertical-Cavity Surface-Emitting Lasers (VCSELs) on a wafer are provided. An illustrative method of is provided that includes: applying a stimulus to each of the plurality of VCSELs on the wafer; measuring, for each of the plurality of VCSELs, two or more VCSEL parameters responsive to the stimulus; correlating the measured two or more VCSEL parameters to define a value of a common performance characteristic; and identifying clusters of VCSELs having similar values of the common performance characteristic. The clusters of VCSELs may be determined to collectively meet or not meet an optical performance requirement defined for the VCSELs on the wafer.

Wafer level analysis for VCSEL screening

Systems, computer program products, and methods are described herein for intelligent data compression, in accordance with an embodiment of the invention. The present invention may be configured to receive a plurality of files for storage in a database and perform a series of steps iteratively, for each file of the plurality of files, and until each file of the plurality of files is represented in the database. The series of steps may include identifying one or more data points in the respective file, where each identified data point was previously unidentified in the database and adding the identified one or more data points to the database. The series of steps may also include identifying one or more features of the respective file for storage in the database and storing the identified one or more features in the database as a surrogate for the respective file.

Systems and methods for intelligent data compression

A substrate carrier and a mechanism for moving the substrate carrier through a chemical vapor deposition system are provided. The substrate carrier includes a cylindrical housing having an interior surface. A plurality of plurality of shelves fixed to the interior surface, each shelf configured to support at least one substrate. The substrate carrier may include a connector configured to engage the substrate carrier with the mechanism. The mechanism may include a moveable arm and a motor configured to actuate the moveable arm. The moveable arm may include an actuating member connected to the motor and configured to move the moveable arm between a retracted state and an extended state. The moveable arm may be configured to operate in a chamber having a first pressure and a first temperature and the motor may be configured to operate in an environment having a second pressure.

CVD system with substrate carrier and associated mechanisms for moving substrate therethrough

A method and system for large scale Vertical-Cavity Surface-Emitting Laser (VCSEL) binning from wafers to be compatible with a Clock-Data Recovery Unit (CDRU) and/or a VCSEL driver are provided. An illustrative method of binning is provided that includes: for at least a portion of VCSELs on a wafer, measuring a set of representative parameters of the VCSELs, of predetermined DC or small-signal values, and sorting the measured VCSELs into clusters according to the measured set of representative parameters of the VCSELs; further sorting the clusters into sub-groups that comply with specifications of the VCSEL driver; and providing a feedback signal to the CDRU for equalizing control signals provided to the VCSEL driver.

VCSEL binning for optical interconnects

Embodiments are disclosed for a coupling element with embedded modal filtering for a laser and/or a photodiode. An example system includes a laser and an optical coupling element. The laser is configured to emit an optical signal. The optical coupling element is configured to receive the optical signal emitted by the laser. The optical coupling element is also configured to be connected to an optical fiber such that, in operation, the optical signal is transmitted from the laser to the optical fiber via the optical coupling element. Furthermore, the coupling element comprises a tapered section that provides modal filtering of the optical signal.

Coupling element with embedded modal filtering for a laser and/or photodiode

Optical components and associated methods of manufacturing are provided. An example optical component includes a body defined by an optical interposer substrate and a passivation layer applied to the optical interposer substrate. The optical interposer substrate defines a first surface of the body, and the passivation layer defines a second surface of the body opposite the first surface. The passivation layer includes a metallic shielding element configured to prevent interference between the first surface and the second surface. The optical component further includes an opening extending from the second surface to the optical interposer substrate, the opening defining an optical path through the passivation layer. The optical interposer substrate receives an optical signal from an optical transmitter supported by the second surface via the optical path.

Optical components with reduced interference

An authentication method, network switch, and network device are provided. In one example, a method is described that includes receiving a first signal indicative of a data lane being activated and configured to carry data to or within the network switch, receiving a second signal indicative of an authentication lane being established in the network switch or a device connected to the network switch, where the authentication lane is different from the data lane, and enabling data transmission across the data lane only in response to receiving the second signal indicative of the authentication lane being established.

Authentication and data lane control

Optical communication modules and associated methods and computer program products for performing network communication security are provided. An example optical module includes a substrate, a first optoelectronic component supported by the substrate configured for operation with optical signals having a first wavelength, and a second optoelectronic component supported by the substrate configured for operation with optical signals having a second wavelength. The module further includes an optical communication medium defining a first end in optical communication with the first optoelectronic component and the second optoelectronic component and a second end. The module also includes security circuitry operably connected with the first optoelectronic component and the second optoelectronic component. The security circuitry determines the presence of a noncompliant component coupled with the optical communication medium at the second end based upon operation of the second optoelectronic component.

Optical communication modules with improved security

A package includes a light emitting portion configured to emit light, a lens including a first lens surface and a second lens surface, a protective layer between the light emitting portion and the first lens surface and that shields the first lens surface from a surrounding environment, and an optical component that redirects light output from the second lens surface. The first lens surface is configured to receive the emitted light from the light emitting portion, the second lens surface is configured output light that has passed through the first lens surface, and the protective layer has a refractive index greater than 1.5.

Optical transceivers with protective layers

Optical communication modules, optical communication cables, and associated methods of manufacturing are provided. An example optical communication module includes a substrate supporting a first optical transceiver and a second optical transceiver. The first optical transceiver includes a first optical transmitter that generates optical signals having a first wavelength and a first optical receiver that receives optical signals having a second wavelength. The second optical transceiver includes a second optical transmitter that generates optical signals having the second wavelength and a second optical receiver that receives optical signals having the first wavelength. One or more lens assemblies coupled with the respective transceivers may be used to direct optical signal generated by and directed to the respective transceivers.

Optical communication modules and cables

Systems and methods for marking of objects, such as keys/key-blanks, in a production line are disclosed. The objects are marked by applying a marking composition(s) to pre-selected areas on the surface thereof. The system includes a marking unit for dispensing a volume of marking composition in one or more localized pre-selected areas on the surface of an object to be marked; a holder/gripper for positioning the object to be marked in one or more positions relative to the marking unit so as to allow the marking unit to dispense the marking composition on the one or more pre-selected localized areas; a reading/verification unit for detecting the marking composition applied to the object thereby verifying that the objects are properly marked; an orientation sensing unit for identifying the orientation of the object to be marked relatively to the holder. The system also includes a controller configured for controlling the operation of the holder, orientation sensing unit, and the marking unit. The reading/verification unit is adapted to identify the marking composition in the one or more pre-selected areas on surface of the object by detecting an electromagnetic signal (such as XRF signal) emitted from the marking composition (e.g. in response to its illumination by X-ray or gamma-ray).

Object marking system and method

An printed circuit board (PCB) assembly and method of assembling the same for a high-speed, short-reach communication link are described that provide a mechanism for transmitting radio frequency (RF) waves from one digital electronic component of the PCB assembly to another, where the second digital electronic component is located either on the same PCB assembly or on a second PCB assembly. The assembly includes a PCB having multiple layers and a digital electronic component supported by the PCB. At least one of the layers defines a channel that confines RF waves therein. An RF antenna in communication with the digital electronic component extends into the channel, and the RF antenna transmits RF signals generated by the digital electronic component into the channel as RF waves or receives RF waves via the channel and conveys corresponding RF signals to the digital electronic component.

Wireless printed circuit board assembly with integral radio frequency waveguide

An optical component assembly is provided including a substrate. The assembly includes an optical transmitter configured to transmit an optical signal, an optical receiver configured to receive the optical signal, and an optical waveguide extending between the optical transmitter and the optical receiver. The assembly further includes a frangible region defining a first portion of the substrate and a second portion of the substrate, wherein the frangible region is configured to allow the first portion to be separated from the second portion. The assembly may be configured to be modified from a testing configuration, in which the first portion is integrally connected to the second portion via the frangible region, to an operational configuration, in which the first portion is separated from the second portion such that communication of optical signals between the optical transmitter and the optical receiver is precluded.

Optical component assembly and waveguide loopback

An internally wireless datacenter rack configured to support datacenter computing equipment is provided. The datacenter rack includes a housing configured to receive a first networking box including a printed circuit board assembly and one or more wireless connectors in electrical communication with the printed circuit board assembly. The housing includes a second networking box including a printed circuit board assembly and one or more wireless connectors in electrical communication with the printed circuit board assembly. The one or more wireless connectors convert between electrical signals and optical signals. The datacenter rack includes a wireless free space region within the housing, and the wireless free space region includes a wireless reflective backplane that allows free space wireless communication between the first networking box and the second networking box.

Internally wireless datacenter rack

Growing community of inventors

Yoqneam Ilit, Israel

Yaakov Gridish