Shenzhen Goodix Technology Co., Ltd.

Ya Wei

Haoxiang Dong

Wei Long

Baoquan Wu

Hanjian Leng

A biological information identification apparatus is provided, including: a fingerprint identification module and a packaging layer disposed on a surface of the fingerprint identification module facing a user, and configured to package the fingerprint identification module to insulate the fingerprint identification module from an outside environment, a top surface of the packaging layer being an arc surface. The fingerprint identification module includes: a fingerprint identification chip configured to identify fingerprint information of the user, where a plurality of capacitive pixel units are disposed on an upper surface of the fingerprint identification chip, and the capacitive pixel units are configured to form capacitance with a finger of the user; and a plurality of conductive elements disposed above the capacitive pixel units. An electronic device including the aforementioned biological information identification apparatus is provided.

Biological information identification apparatus and electronic device

Embodiments of the present application provide a chip package structure, a chip package method and a terminal device. The chip package structure includes: an optical sensing chip, including a first surface and a second surface, where the first surface is provided with a first pad, the second surface is provided with a connecting end, the first pad is electrically connected to the connecting end, and the connecting end is configured to implement an electrical connection between the chip package structure and the exterior; and an optical path modulating structure, disposed above the first surface, and configured to perform an optical path modulation on an optical signal reflected from a human finger and make the signal incident on the first surface, or perform the optical path modulation on an optical signal emitted from the first surface and make the signal exit to the human finger.

Chip package structure, chip package method and terminal device

Embodiments of the present application, pertaining to the technical field of optical devices, provide an optical module and a fabrication method thereof, and a terminal device using the same. The optical module includes a lens and a sensor package. The lens is positioned at an uppermost position of the optical module and attached to a lower position of a terminal screen, and is configured to transmit light passing through the screen; the sensor package includes an optical sensor, where a photosensitive region is arranged on an upper surface of the optical sensor, and the photosensitive region is configured to receive light passing through the lens; and the sensor package further includes an air gap, and the photosensitive region of the optical sensor is configured to receive the light passing through the screen via the air gap.

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Shenzhen, China

Ya Wei