Lite-On Technology Corporation

Lite-On Electronics (Guangzhou) Limited

Ya-Tung I

Chien-Hua Chu

Wen-Chi Chen

Yi-Jen Lu

An electronic module includes first and second shells respectively having first and second edge surfaces with respective first and second joint units jointed together by ultrasonic welding. The first joint unit has first and second projection portions on the first edge surface, a first indentation portion between the first and second projection portions, and a bump on the second projection portion. The second joint unit complementarily engages the first joint unit. First and second bonding layers are respectively formed between the first indentation portion and the second joint unit and between the second projection portion and the second joint unit. Waterproof cable assemblies are mounted to the shells.

Electronic module with an improved shell and method for making the same

A housing includes a first surrounding wall connected around a base wall. The first surrounding wall has a first joint portion opposite to the base wall, a first outer surface and a first inner surface. The first outer and inner surfaces extend from the first joint portion toward the base wall. The first joint portion is stepped and has a first projecting portion adjoining the first outer surface, and a first shoulder portion indented from the first projecting portion and proximal to the first inner surface. The first shoulder portion has a plurality of parallel spaced-apart ribs protruding therefrom in a same direction as the first projecting portion. Each of the ribs has a tip that does not extend beyond a top end of the first projecting portion.

Housing having housing parts bondable together and method of manufacturing the same

The instant disclosure relates to a planar heat dissipation structure, which comprises a first electrically insulating and thermally conductive layer having a thermal conductivity coefficient greater than 0.5 W/mK and a metal layer chemically bonded to and in thermal contact with the first electrically insulating and thermally conductive layer. The planar heat dissipation structure forms a one-piece structure that is configurable from a substantially planar collapsed state to a folded three-dimensional state, and defines a base portion and at least one flap portion configured to be foldable with respect to the base portion thereon, such that the first electrically insulating and thermally conductive layer constitutes an inner surface of the planar heat dissipation structure to define a covering space. The instant disclosure also discloses an electronic device that utilizes said foldable planar heat dissipation structure.

Planar heat dissipation structure and electronic device utilizing the same

An assembly structure for assembling a first plastic shell and a second plastic shell, thereby coupling articles to be assembled such as keyboards and adapters, including a hollow strut and an opening. The first plastic shell has the hollow strut extended from the inner side. The second plastic shell has the opening defined therein and corresponding to the hollow strut and extends inwards to form an annular flange abutting the hollow strut. The hollow strut has a portion extended through the annular flange to be melted by the ultrasonic welding technique, the thermal welding technique, or the combination thereof until reaching the annular flange, to couple the first and second plastic shells for facilitating assembly. Grinding off the melted portion may disassemble the first and second plastic shells. The disassembled the first and second plastic shells may be coupled again by fastening a fastening element in the hollow strut with the head of the fastening element held by the annular flange.

Growing community of inventors

Taipei, Taiwan

Ya-Tung I