Advanced Optoelectronic Technology, Inc.

Ya-Ting Wu

Chung-Min Chang

Chien-Lin Chang-Chien

Zheng-Hua Yang

Hsuen-Feng Hu

Chang-Wen Sun

A light emitting diode package includes a substrate, several light emitting diodes mounted on the substrate, and a package member enveloping the light emitting diodes. The light emitting diodes are electrically coupled to the substrate. The package member includes at least two layers, the first layer and the second layer. The first layer is spread on the substrate and completely covers the light emitting diodes and the wires. The second layer is formed on the first layer. Fluidity of colloid forming the second layer is worse than that of the first layer. A method is also provided to manufacture the present light emitting diode package.

LED package and manufacturing method thereof

An light emitting diode (LED) module includes a circuit board, a plurality of LED chips arranged on and electrically connected to the circuit board, and an encapsulant arranged on the circuit board and covering the LED chips, a plurality of first recesses defined in a first surface of the circuit board.

LED module with circuit board having a plurality of recesses for preventing total internal reflection

An light emitting diode (LED) module includes a circuit board, a set of LED chips formed on and electrically connected to the circuit board, and an encapsulant arranged on the circuit board and covering the LED chips, a set of first recesses defined in a top surface of the encapsulant.

LED module

An exemplary light emitting device includes a blue-green light source and a orange-red light source. The blue-green light source emits blue-green light and the orange-red light source emits orange-red light when they are activated. The blue-green light and the orange-red light are mixed together to obtain white light.

Growing community of inventors

Hsinchu, Taiwan

Ya-Ting Wu