Taiwan Semiconductor Manufacturing Comp. Ltd.

Mediatek Corporation

Ya-Ting Tsai

Kei-Wei Chen

Ying-Tsung Chen

Gin-Chen Huang

Ssutzu Chen

Chia-Hsin Yang

Wen-Kai Chiu

Kuo-Hsiung Huang

Kun-Tien Kuo

A cleaning system includes at least one cleaning module configured to receive a substrate after a chemical mechanical polishing (CMP) process and to remove contaminants on the substrate using a cleaning solution. The cleaning system further includes a cleaning solution supply system configured to supply the cleaning solution to the at least one cleaning module. The cleaning solution supply system includes at least one temperature control system. The at least one temperature control system includes a heating device configured to heat the cleaning solution, a cooling device configured to cool the cleaning solution, a temperature sensor configured to monitor a temperature of the cleaning solution, and a temperature controller configured to control the heating device and the cooling device.

Chemical mechanical polishing cleaning system with temperature control for defect reduction

A mobile electronic apparatus including an audio receiver and a controller is provided. The audio receiver receives a reference signal via a first hole and a second hole on a housing of the mobile electronic apparatus. The controller detects a touch event on the second hole according to the received reference signal.

Apparatuses and methods for providing a virtual input key

Growing community of inventors

Hsinchu, Taiwan

Ya-Ting Tsai