Siliconware Precision Industries Co., Ltd.

Ya-Ting Chi

Yi-Lin Tsai

Hsiu-Fang Chien

Chia-Wen Tsao

Wen-Chen Hsieh

Hsin-Yin Chang

An electronic package is provided and includes a substrate structure, an electronic element disposed on the substrate structure and an encapsulation layer encapsulating the electronic element, where at least one functional circuit is formed on a surface of a substrate body of the substrate structure, and a wire having a smaller width is arranged on a boundary line at a junction between an encapsulation area and a peripheral area, so that when a mold for forming the encapsulation layer is formed to cover the substrate structure, the mold will create a gap around the wire to serve as an exhaust passage. Therefore, when the encapsulation layer is formed, the exhaust passage can be used to exhaust air, so as to avoid problems such as the occurrence of voids or overflows of the encapsulation layer.

Growing community of inventors

Taichung, Taiwan

Ya-Ting Chi