Mediatek Corporation

Taiwan Semiconductor Manufacturing Comp. Ltd.

Interface Optoelectronics (shenzhen) Co., Ltd.

General Interface Solution Limited

Interface Technology (chengdu) Co., Ltd.

Other

National Taiwan University

Biv Medical, Ltd.

Industrial Technology Research Institute

Vanguard International Semiconductor Corporation

Miniwiz Co., Ltd.

Ya-Ting Chang

Jia-Ming Chen

Ru-Gun Liu

Tsai-Sheng Gau

Wen-Chun Huang

Ming-Hui Chih

Chia-Ping Chiang

Wen-Li Cheng

Hung-Lin Chou

Yu-Ming Lin

Chih-Wei Hsu

Ping-Chieh Wu

Tsung-Yu Wang

Yen-Heng Huang

Chun-Nan Chen

Yin Jen Chen

Wei-Chih Huang

Shiming Lin

Pang-Chiang Chia

Chia-Hao Hsu

Ke-Horng Chen

Chih-Cherng Liao

Ming-Hsien Lee

Tsung-Hsiung Lee

Jeng-Ywan Jeng

Yu-Po Tang

Yu-Ting Chen

Kwang-Ming Lin

Nian-Fuh Cheng

Jia-Wei Fang

Jih-Ming Hsu

Chih-Shiang Chou

Chih-I Wu

Yu-Jui Chang

Yu-Chia Chang

Chao-Jen Huang

Yun-Ching Li

Chien-Yuan Lai

Fu-Sheng Chu

Chia-Lin Chuang

I-Chih Ni

Chorng-Shyan Chern

Jian-Zhi Huang

Chia-Chun Hsieh

I-Ping Lee

Lee-Kee Yong

Hui En Yin

Yen-Chang Yao

Shih-Yen Chiu

Pi-Cheng Hsiao

Nicholas Ching Hui Tang

Tai-Wu Lin

Yen-Lin Lee

Cheng-Yan Guo

Tai-Cun Lin

Shih-Wei Chiang

Tzu-Jen Lo

Chian-Chi Huang

Bo-Jr Huang

Tzu-Wei Liu

Yi-Pin Lin

Jen-Chieh Yang

Chih-Ching Lin

Kai-Chuan Kan

Yi-Chun Chang

Nai-Hau Shiue

Ting-Chang Huang

Mark Shane Peng

Wan-Ching Huang

Yeh-Ji Chou

Fan-Lei Liao

Chih-Chiang Lin

Jing-Bing Yu

Shun-Yao Yang

Ta-Chang Liao

Chung-Ho Chang

Shou-Wen Ho

Chun-Hang Wei

Li-Chun Hsu

Yen-Hsun Chen

Chun-Hung Chen

Ya-Huei Kuo

Pei-Yu Chang

Zheng-Xian Wu

Yow-Shiuan Liu

Cheng-Che Lu

Cheng-Yuh Wu

Wen-Wen Hsieh

Min-Shu Wang

Chih Fu Tsai

Tai Yu Chen

Kong-Sang Jackie Chan

Shengquan Wu

Tian-Jia Hsieh

Jin-Bin Yang

Chien-Hao Chiang

Enzo-Louis Muttini

Jing-Ting Wu

Kuo-SU Hsiao

Koon Woon Soon

A multi-processor system performs thermal-aware task scheduling and task migration. Based on temperature measurements, the system determines one or more thermal conditions of each processor. The thermal conditions include a present temperature, a historical temperature, a predicted temperature, and thermal headroom of the processor. A scheduler identifies a target processor among the processors based on, at least in part, the one or more thermal conditions of each processor, and assigns a task to be executed by the target processor. For task migration, the system detects that a source processor satisfies a task migration criterion by comparing one or more of the thermal conditions of the source processor with corresponding thresholds. The scheduler identifies a target processor based on, at least in part, one or more of the thermal conditions of each processor, and migrates a task from the source processor to the target processor for execution.

Thermal-aware task scheduling

Implementations of the present disclosure provide coloring methods that sort and pre-color nodes of G0-linked networks in a multiple-patterning technology (MPT)-compliant layout design by coordinate. In one embodiment, a method includes identifying target networks in a circuit layout, each target network having two or more linked nodes representing circuit patterns, and each target network being presented in an imaginary X-Y coordinate plane, assigning a first feature to a first node in each target network, the first node is determined using a coordinate-based method, and assigning the first feature and a second feature to remaining nodes in each target network in an alternating manner so that any two immediately adjacent linked nodes in each target network have different features.

Method for coloring circuit layout and system for performing the same

A method for forming an integrated circuit device is provided. The method includes forming a transistor over a frontside of a substrate; forming an interconnect structure over the transistor; depositing a first transition metal layer over the interconnect structure; performing a plasma treatment to turn the first transition metal layer into a first transition metal dichalcogenide layer; forming a dielectric layer over the first transition metal dichalcogenide layer; forming a first gate electrode over the dielectric layer and a first portion of the first transition metal dichalcogenide layer; and forming a first source contact and a first drain contact respectively connected with a second portion and a third portion of the first transition metal dichalcogenide layer, the first portion of the first transition metal dichalcogenide layer being between the second and third portions of the first transition metal dichalcogenide layers.

Integrated circuit device and method for forming the same

A system performs adaptive thermal ceiling control at runtime. The system includes computing circuits and a thermal management module. When detecting a runtime condition change that affects power consumption in the system, the thermal management module determines an adjustment to the thermal ceiling of a computing circuit, and increases the thermal ceiling of the computing circuit according to the adjustment.

Adaptive thermal ceiling control system

The present invention provides an electrocardiographic monitoring device comprising a device body configured to be attached to a user's chest; a plurality of electrodes provided on the device body; and a controller provided on the device body and connected to the electrodes in order to obtain the user's electrocardiographic signal waveforms. The electrocardiographic monitoring device of the invention can be applied in a blood pressure monitoring system for monitoring a user's blood pressure.

Electrocardiographic monitoring device and blood pressure monitoring system using the same

The present invention provides a method for 3D inkjet printing, which comprises: a preheating step: an external heating source is used to heat a main body layer composed of a first composition to a first temperature, wherein the main body layer has a thickness of 10 &#x3bc;m to 500 &#x3bc;m and a unit density of 0.1 to 1.0 g/cm, and the first temperature is less than the melting point of the first composition; a heating step: a second composition is applied to the surface of the first composition at the first temperature of the composite to proceed an exothermic cross-linking polymerization, so that the main body layer is heated to a second temperature to become a molten state; and a cooling step: the main body layer in the molten state is cooled down and solidified to form.

3D printing set and method for 3D inkjet printing by using the same

Methods of forming semiconductor devices are provided. The methods include: forming a trench in a substrate, wherein the trench includes a defect protruding from a bottom surface of the trench; forming a flowable material on the substrate to at least partially cover the defect; performing an etching process to reduce the height of the defect; and removing the flowable material.

Methods for forming semiconductor devices

The present invention provides a dynamic measurement device with a blood pressure determination function, comprising: a heartbeat sensing module disposed on the chest area of a user wherein the heartbeat sensing module comprising a heart sound sensor for obtaining heartbeat signals; a pulse sensing module disposed on a limb area of the user, the pulse sensing module comprising a pulse wave sensor for obtaining pulse signals; and a data calculating module for calculating a mean arterial pressure and a value of systolic blood pressure and diastolic blood pressure based on the heartbeat signals and pulse signals. In addition to dynamically monitoring the blood pressure of a user for 24 hours, the present invention can dynamically monitor the heart sounds of the user for 24 hours individually in order to monitor user's physical condition. Therefore, the present invention has important medical meanings.

Dynamic measurement device with a blood pressure determination function

A multi-processor system includes multiple processors arranged in multiple clusters. Different clusters have different power and performance characteristics. The system includes a task scheduler to schedule tasks to the processors. The task scheduler, in response to detection of a scheduling event trigger, is operative to identify a scheduling objective between a first objective of energy optimization and a second objective of load balance. The scheduling objective is identified based on at least respective operating frequencies and loading of all processors in a highest-capacity cluster of the multiple clusters. According to the identified scheduling objective, the task scheduler schedules a given task to a processor selected among the processors in the multiple clusters.

Switch policy for hybrid scheduling in multi-processor systems

A touch knob which can transmit user touches above to a touch-sensitive surface below includes a base, a rotating shaft, and a rotating cap. The rotating cap defines a receiving groove facing the base, and the rotating shaft extends into the receiving groove and is connected to the rotating cap. The rotating cap is configured to rotate to transmit user touches in a bounded circular area, at least one conductive touch head is located on the rotating cap and in the receiving groove, and moves as the rotating cap moves. The disclosure avoids the need to cut or form any opening in the cover of the touch-sensitive surface or panel for buttons to be installed. A device using the above touch knob is also provided.

Touch knob and device using same

An ambient-light-sensing hole structure package and a method of manufacturing the same are provided. The ambient-light-sensing hole structure package includes a transparent cover, a decorative layer, a porous structure layer, and an optical adhesive. The transparent cover has a surface. The decorative layer is disposed on the surface and the decorative layer has an opening that exposes a portion of the surface. The porous structure layer is disposed on one side of the decorative layer and the porous structure layer covers the portion of the surface. The porous structure layer includes a plurality of through holes, and the through holes overlap with the opening. The optical adhesive is interposed between the decorative layer and the porous structure layer.

Ambient-light-sensing hole structure package and method of manufacturing the same

A touch panel capable of being simply manufactured includes a foldable substrate, a plurality of touch driving electrodes on the substrate, and a plurality of touch sensing electrodes on the substrate. The substrate includes two laminated layers achieved by folding. The touch driving electrodes are on one of the two laminated layers and the touch sensing electrodes are on the other of the two laminated layers. The touch driving electrodes and the touch sensing electrodes are formed by a same conductive layer on a surface of the substrate.

Touch panel and method for making same

Growing community of inventors

Hsinchu, Taiwan

Ya-Ting Chang